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1. WO2006038951 - MELAMINE-FORMALDEHYDE POST-DIP COMPOSITION FOR IMPROVING ADHESION OF METAL TO POLYMER

Publication Number WO/2006/038951
Publication Date 13.04.2006
International Application No. PCT/US2005/025259
International Filing Date 18.07.2005
IPC
C23C 28/00 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
28Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C2/-C23C26/173
C09J 5/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
CPC
C08G 12/32
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
12Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
02of aldehydes
26with heterocyclic compounds
30with substituted triazines
32Melamines
C08G 12/427
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
12Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
02of aldehydes
40Chemically modified polycondensates
42by etherifying
424of polycondensates based on heterocyclic compounds
425based on triazines
427Melamine
C09D 5/12
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
5Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced
08Anti-corrosive paints
12Wash primers
C23C 22/52
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
22Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
05using aqueous solutions
06using aqueous acidic solutions with pH less than 6
48not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
52Treatment of copper or alloys based thereon
C23C 22/83
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
22Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
82After-treatment
83Chemical after-treatment
C23F 1/18
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
1Etching metallic material by chemical means
10Etching compositions
14Aqueous compositions
16Acidic compositions
18for etching copper or alloys thereof
Applicants
  • MACDERMID, INCORPORATED [US]/[US] (AllExceptUS)
Inventors
  • FERRIER, Donald, R.
Agents
  • CORDANI, John, L.
Priority Data
10/956,91230.09.2004US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MELAMINE-FORMALDEHYDE POST-DIP COMPOSITION FOR IMPROVING ADHESION OF METAL TO POLYMER
(FR) COMPOSITION DE MELAMINE-FORMALDEHYDE POST-IMMERSION DESTINEE A AMELIORER L'ADHERENCE ENTRE METAL ET POLYMERE
Abstract
(EN)
The present invention is directed to a process for increasing the adhesion of a polymeric material to a metal surface, especially during the manufacture of printed circuit boards. The metal surface is contacted with an adhesion promoting composition to form a micro-roughened surface and is then contacted with an aqueous amine-formaldehyde post-dip polymer composition. The amine is preferably melamine. Thereafter polymeric material may be bonded to the treated metal surface. The amine formaldehyde polymer post-dip composition comprises an acid, a pH adjuster, and an effective amount of an amine-formaldehyde reaction product polymer. The amine-formaldehyde reaction product polymer is formed by dissolving amine in an aqueous formaldehyde solution, adding an additive selected from the group consisting of triethanolamine, ethylene glycol, and methanol, adding an acid selected from the group consisting of acetic acid and sulfuric acid, diluting the solution with water, and adjusting the pH of the solution with a pH adjuster.
(FR)
L'invention concerne un procédé permettant d'accroître l'adhérence entre une matière polymère et une surface métallique, notamment pendant la fabrication de cartes de circuit imprimé. Le procédé comporte les étapes consistant à: mettre la surface métallique en contact avec une composition favorisant l'adhérence pour former une surface présentant des microrugosités, puis avec une composition polymère aqueuse amine-formaldéhyde post-immersion, l'amine étant de préférence la mélamine; lier ensuite la matière polymère à la surface métallique traitée. La composition polymère amine-formaldéhyde post-immersion comprend un acide, un régulateur de pH et une quantité efficace d'un polymère résultant de la réaction amine-formaldéhyde. On forme le polymère résultant de la réaction amine-formaldéhyde en mettant en oeuvre les étapes consistant à: dissoudre l'amine dans une solution aqueuse de formaldéhyde, ajouter un additif sélectionné dans le groupe constitué par la triéthanolamine, l'éthylène glycol et le méthanol, ajouter un acide sélectionné dans le groupe constitué par l'acide acétique et l'acide sulfurique, diluer la solution avec de l'eau et ajuster le pH de la solution au moyen d'un régulateur de pH.
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