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1. WO2006036904 - INTERFEROMETRIC MODULATOR WITH REDUCED SLIPPAGE BETWEEN STRUCTURES AND METHOD OF MAKING THE INTERFEROMETRIC MODULATOR

Publication Number WO/2006/036904
Publication Date 06.04.2006
International Application No. PCT/US2005/034465
International Filing Date 23.09.2005
IPC
G02B 26/00 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating or modulating
CPC
G02B 26/001
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating
001based on interference in an adjustable optical cavity
Applicants
  • IDC, LLC [US]/[US] (AllExceptUS)
  • TUNG, Ming-Hau [US]/[US] (UsOnly)
  • ARBUCKLE, Brian, W. [US]/[US] (UsOnly)
  • FLOYD, Philip, D. [US]/[US] (UsOnly)
  • CUMMINGS, William, J. [US]/[US] (UsOnly)
Inventors
  • TUNG, Ming-Hau
  • ARBUCKLE, Brian, W.
  • FLOYD, Philip, D.
  • CUMMINGS, William, J.
Agents
  • ABUMERI, Mark, M.
Priority Data
11/203,61312.08.2005US
60/613,49927.09.2004US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) INTERFEROMETRIC MODULATOR WITH REDUCED SLIPPAGE BETWEEN STRUCTURES AND METHOD OF MAKING THE INTERFEROMETRIC MODULATOR
(FR) MODULATEUR INTERFEROMETRIQUE A GLISSEMENT REDUIT ENTRE STRUCTURES ET PROCEDE DE FABRICATION DE CE MODULATEUR INTERFEROMETRIQUE
Abstract
(EN)
A support structure (18) within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure (18) and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure (18) and a substrate layer (20). In another embodiment, increased adhesion is achieved between a support structure (18) and a moveable layer (14). Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.
(FR)
Une structure de support (18) présente au sein d'un dispositif modulateur interférométrique peut entrer en contact avec diverses autres structures à l'intérieur dudit dispositif. Il est possible d'obtenir des résistances à l'adhérence améliorées entre la structure de support (18) et les autres structures de diverses manières, par exemple au moyen de surfaces rugueuses et/ou de matières adhésives au niveau des interfaces entres les structures de support et les autres structures. Dans un mode de réalisation de l'invention, une adhérence accrue est obtenue entre une structure de support (18) et une couche de substrat (20). Dans un autre mode de réalisation, une adhérence accrue est obtenue entre une structure de support (18) et une couche mobile (14). L'adhérence accrue peut réduire le glissement indésirable entre les structures de support et les autres structures auxquelles elles sont attachées à l'intérieur du modulateur interférométrique.
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