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1. WO2006036412 - ENDPOINT ADJUSTMENT IN ELECTROPROCESSING

Publication Number WO/2006/036412
Publication Date 06.04.2006
International Application No. PCT/US2005/030393
International Filing Date 25.08.2005
IPC
B23H 5/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
5Combined machining
06Electrochemical machining combined with mechanical working, e.g. grinding or honing
B23H 5/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
5Combined machining
06Electrochemical machining combined with mechanical working, e.g. grinding or honing
08Electrolytic grinding
B24B 37/04 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
B24B 49/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
02according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
04involving measurement of the workpiece at the place of grinding during grinding operation
B24B 49/16 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
16taking regard of the load
H04N 1/00 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
1Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
CPC
B23H 5/06
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
5Combined machining
06Electrochemical machining combined with mechanical working, e.g. grinding or honing
B23H 5/08
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
HWORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
5Combined machining
06Electrochemical machining combined with mechanical working, e.g. grinding or honing
08Electrolytic grinding
B24B 37/013
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
013Devices or means for detecting lapping completion
B24B 37/042
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
042operating processes therefor
B24B 37/046
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
046using electric current
B24B 49/04
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
02according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
04involving measurement of the workpiece at the place of grinding during grinding operation
Applicants
  • APPLIED MATERIALS, INC. [US]/[US] (AllExceptUS)
  • WANG, Yan [US]/[US] (UsOnly)
  • MANENS, Antoine P. [FR]/[US] (UsOnly)
  • NEO, Siew S. [SG]/[US] (UsOnly)
  • DUBOUST, Alain [FR]/[US] (UsOnly)
  • CHEN, Liang-Yuh (UsOnly)
Inventors
  • WANG, Yan
  • MANENS, Antoine P.
  • NEO, Siew S.
  • DUBOUST, Alain
  • CHEN, Liang-Yuh
Agents
  • PATTERSON, B. Todd
Priority Data
10/949,16024.09.2004US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ENDPOINT ADJUSTMENT IN ELECTROPROCESSING
(FR) FIXATION DE POINTS LIMITES DANS UN ELECTRO-TRAITEMENT
Abstract
(EN)
Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response to the detected breakthrough. In another embodiment, the target endpoint is adjusted relative to an amount of underlying layer exposed through the conductive layer.
(FR)
L'invention porte sur un procédé de commande d'un électro-traitement qui dans une exécution consiste: à traiter une couche conductrice formée sur une tranche en utilisant un point limite, à détecter la percée de la couche conductrice pour exposer des parties de la couche sous-jacente, et à régler le point limite cible en réponse à la percée détectée. Dans une autre exécution, le point limite cible se règle par rapport à la quantité de surface sous-jacente exposée à travers la couche conductrice.
Also published as
Latest bibliographic data on file with the International Bureau