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1. WO2006035518 - RF CIRCUIT MODULE

Publication Number WO/2006/035518
Publication Date 06.04.2006
International Application No. PCT/JP2005/000903
International Filing Date 25.01.2005
IPC
H04B 1/40 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
BTRANSMISSION
1Details of transmission systems, not covered by a single one of groups H04B3/-H04B13/123; Details of transmission systems not characterised by the medium used for transmission
38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
40Circuits
H05K 1/14 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
CPC
H04B 1/40
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
BTRANSMISSION
1Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
40Circuits
H05K 1/0243
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0237High frequency adaptations
0243Printed circuits associated with mounted high frequency components
H05K 1/185
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
182associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
Applicants
  • 株式会社村田製作所 MURATA MANUFACTURING CO., LTD. [JP]/[JP] (AllExceptUS)
  • 山内淳 YAMAUCHI, Atsushi [JP]/[JP] (UsOnly)
  • 北田宏明 KITADA, Hiroaki [JP]/[JP] (UsOnly)
  • 堀正和 HORI, Masakazu [JP]/[JP] (UsOnly)
  • 玉越修 TAMAKOSHI, Osamu [JP]/[JP] (UsOnly)
  • 藤田真 FUJITA, Makoto [JP]/[JP] (UsOnly)
Inventors
  • 山内淳 YAMAUCHI, Atsushi
  • 北田宏明 KITADA, Hiroaki
  • 堀正和 HORI, Masakazu
  • 玉越修 TAMAKOSHI, Osamu
  • 藤田真 FUJITA, Makoto
Agents
  • 小森久夫 KOMORI, Hisao
Priority Data
2004-28033527.09.2004JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) RF CIRCUIT MODULE
(FR) MODULE DE CIRCUIT RF
(JA) RF回路モジュール
Abstract
(EN)
A stacked dielectric board (10) constituting an RF circuit module is composed of an upper layer (11) and a lower layer (12). On the upper layer (11), an IC (1) and an RF filter (4) are arranged, and on the lower layer (12), a power amplifier (2) and an antenna switch (3) are arranged. The antenna switch (3) is arranged at a position close to one edge plane of the stacked dielectric board (10), and the RF amplifier (4) is arranged at a position partially overlapping the antenna switch (3) in plan view. The IC (1) and the power amplifier (2) are also arranged at positions partially overlapping each other in plan view.
(FR)
Carte diélectrique superposée (10) constituant un module de circuit RF étant composée d’une couche supérieure (11) et d’une couche inférieure (12). Sur la couche supérieure (11), un circuit intégré (1) et un filtre RF (4) sont agencés, et sur la couche inférieure (12), un amplificateur de puissance (2) et un commutateur d’antenne (3) sont agencés. Le commutateur d’antenne (3) est agencé à une position proche d’un plan de bord de la carte diélectrique superposée (10), et l’amplificateur RF (4) est agencé à une position recouvrant partiellement le commutateur d’antenne (3) dans une vue de dessus. Le circuit intégré (1) et l’amplificateur de puissance (2) sont également agencés à des positions se recouvrant partiellement les unes les autres dans une vue de dessus.
(JA)
 RF回路モジュールを構成する積層誘電体基板(10)は、上層(11)と下層(12)とからなり、上層(11)にはIC(1)とRFフィルタ(4)とが設置され、下層(12)にはパワーアンプ(2)とアンテナスイッチ(3)とが設置されている。ここで、アンテナスイッチ(3)は、積層誘電体基板(10)の一端面に近い位置に設置され、RFアンプ(4)は平面視でアンテナスイッチ(3)と部分的に重なる位置に設置されている。また、IC(1)とパワーアンプ(2)とも平面視で部分的に重なる位置に設置されている。
Also published as
US2007066243
Latest bibliographic data on file with the International Bureau