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Machine translation
1. (WO2006033315) PLATING METHOD AND PLATING APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/033315    International Application No.:    PCT/JP2005/017257
Publication Date: 30.03.2006 International Filing Date: 20.09.2005
IPC:
C25D 5/22 (2006.01), C25D 5/06 (2006.01), C25D 7/00 (2006.01), H05K 3/18 (2006.01)
Applicants: IBIDEN Co., Ltd. [JP/JP]; 1, Kandacho 2-chome Ogaki-shi, Gifu 5030917 (JP) (For All Designated States Except US).
NAKAI, Toru [JP/JP]; (JP) (For US Only).
KAWAI, Satoru [JP/JP]; (JP) (For US Only).
NIWA, Hiroshi [JP/JP]; (JP) (For US Only).
IWATA, Yoshiyuki [JP/JP]; (JP) (For US Only)
Inventors: NAKAI, Toru; (JP).
KAWAI, Satoru; (JP).
NIWA, Hiroshi; (JP).
IWATA, Yoshiyuki; (JP)
Agent: TASHITA, Akihito; 22-6, Sakae 1-chome, Naka-ku Nagoya-shi, Aichi 4600008 (JP)
Priority Data:
2004-277316 24.09.2004 JP
2004-277317 24.09.2004 JP
Title (EN) PLATING METHOD AND PLATING APPARATUS
(FR) PROCEDE ET APPAREIL DE PLACAGE
(JA) めっき方法及びめっき装置
Abstract: front page image
(EN)[PROBLEMS] Plating method and apparatus by which a recess is not formed at the time of forming a field via. [MEANS FOR SOLVING PROBLEMS] A plating apparatus (10) is composed of insulating bodies (20A, 20B) composed of a porous resin (sponge) which abuts to a plating plane of a printed wiring board (30), and a lifting apparatus (24) for vertically moving the insulating bodies (20A, 20B) along the printed wiring board (30). When an electrolytic film (46) gradually becomes thick, the insulating bodies (20) are brought into contact with the film, and at the contact portion, growth of the electrolytic plating film (46) is stopped. Thus, a filed via (60) having a flat surface can be manufactured.
(FR)L'invention porte sur un procédé et appareil de placage permettant de fabriquer une traversée de champ sans formation d'un évidement. L'appareil de placage (10) est constitué de corps isolants (20A, 20B) composés d'une résine poreuse (éponge) qui aboutit à un plan de placage d'une carte de circuit imprimé (30) et d'un appareil de levage (24) permettant de déplacer verticalement les corps isolants (20A, 20B) le long de la carte de circuit imprimé (30). Lorsqu'un film électrolytique (46) s'épaissit progressivement, les corps isolants (20) sont mis en contact avec le film et, au niveau de la partie faisant contact, le développement du film de placage électrolytique (46) est stoppé. Ainsi, on peut fabriquer une traversée de champ (60) présentant une surface plate.
(JA)  【課題】 フィールドビアを形成するにあたり、凹みが形成されないめっき方法、装置を提案する。   【解決手段】 めっき装置10は、プリント配線板30のめっき面に当接する多孔質樹脂(スポンジ)から成る絶縁体20A、20Bと、絶縁体20A、20Bをプリント配線板30に沿って上下動させる昇降装置24とから成る。電解めっき膜46が徐々に厚くなると、絶縁体20が接触することにより、その接触した部分では、電解めっき膜46の成長を止めることがされる。これにより、表面の平坦なフィルドビア60を製造することができる。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)