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1. (WO2006031455) LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2006/031455 International Application No.: PCT/US2005/031150
Publication Date: 23.03.2006 International Filing Date: 31.08.2005
IPC:
G03F 7/00 (2006.01) ,G03F 7/027 (2006.01) ,G03F 7/004 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
Applicants:
BAHADUR, Maneesh [US/US]; US (UsOnly)
CHEN, Wei [US/US]; US (UsOnly)
ALBAUGH, John [US/US]; US (UsOnly)
HARKNESS, Brian [CA/US]; US (UsOnly)
TONGE, James [US/US]; US (UsOnly)
DOW CORNING CORPORATION [US/US]; 2200 West Salzburg Road Midland, MI 48686-0994, US (AllExceptUS)
Inventors:
BAHADUR, Maneesh; US
CHEN, Wei; US
ALBAUGH, John; US
HARKNESS, Brian; US
TONGE, James; US
Agent:
MILCO, Larry, A.; Patent Department-Mail CO1232 2200 West Salzburg Road Midland, MI 48686-0994, US
Priority Data:
60/609,42513.09.2004US
Title (EN) LITHOGRAPHY TECHNIQUE USING SILICONE MOLDS
(FR) TECHNIQUE DE LITHOGRAPHIE DANS LAQUELLE SONT UTILISES DES MOULES EN SILICONE
Abstract:
(EN) A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.
(FR) L'invention concerne un procédé consistant : A) à remplir un moule de silicone possédant une surface à motif avec une préparation durcissable de (méth)acrylate ; B) à durcir la préparation durcissable de (méth)acrylate pour former une caractéristique à motif ; C) à séparer le moule de silicone et la caractéristique à motif ; D) à éventuellement graver la caractéristique à motif ; et E) à éventuellement répéter les étapes A) à D) en réutilisant le moule de silicone. La préparation durcissable de (méth)acrylate contient un (méth)acrylate fonctionnel à base de fluor, un (méth)acrylate, ainsi qu'un photoamorceur.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)