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1. WO2006020578 - SELF-CLEANING LOWER CONTACT

Publication Number WO/2006/020578
Publication Date 23.02.2006
International Application No. PCT/US2005/028160
International Filing Date 08.08.2005
IPC
H01L 23/58 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
G01R 31/28 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
G01R 31/02 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
02Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
CPC
B07C 5/344
BPERFORMING OPERATIONS; TRANSPORTING
07SEPARATING SOLIDS FROM SOLIDS; SORTING
CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
5Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
34Sorting according to other particular properties
344according to electric or electromagnetic properties
G01R 1/06705
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06705Apparatus for holding or moving single probes
G01R 1/06711
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
G01R 31/26
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26Testing of individual semiconductor devices
G01R 31/50
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
H01L 22/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
22Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Applicants
  • ELECTRO SCIENTIFIC INDUSTRIES, INC. [US]/[US] (AllExceptUS)
  • GARCIA, Douglas, J. [US]/[US] (UsOnly)
Inventors
  • GARCIA, Douglas, J.
Agents
  • LEVINE, Michael, L.
Priority Data
10/916,06309.08.2004US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) SELF-CLEANING LOWER CONTACT
(FR) CONTACT INFERIEUR AUTONETTOYANT
Abstract
(EN) An electrical component handler (2) that tests electrical circuit components and includes a self-cleaning lower contact (100) offers reduced yield loss and mean time between assists. A preferred embodiment of the electrical component handler (2) includes multiple sets of upper and lower contacts (102, 100), each set of which is spatially aligned to electrically contact a single device-under-test (DUT) (14). Each DUT (14) is seated in a test plate (5) that transports the DUT (14) to and from a test measurement position between the upper and lower contacts (102, 100). The lower contact (100) includes a contact tip (116) that a biasing mechanism (130) urges against the electrical component as it undergoes a test process and against a surface of the test plate (5) as it transports the electrical component. The lower contact (100) rubs against the test plate (5), thereby contributing to removal of contaminant material acquired by the contact tip (116) during component handler operation.
(FR) L'invention concerne un automate (2) de composants électriques testant des composants de circuits électriques, comprenant un contact inférieur autonettoyant (100) et permettant de réduire une perte de production et un temps moyen entre des événements. Dans un mode de réalisation préféré, l'automate de composants électriques (2) comprend plusieurs ensembles de contacts supérieur et inférieur (102, 100), chaque ensemble étant aligné dans l'espace de manière à venir en contact électrique avec un dispositif unique testé (DUT) (14). Chaque DUT (14) est placé sur une plaque de test (5) transportant celui-ci (14) vers une position de mesure de test, et à partir de celle-ci, entre les contacts supérieur et inférieur (102, 100). Le contact inférieur (100) comprend une pointe de contact (116) contrainte par un mécanisme de sollicitation (130) contre le composant électrique subissant un processus de test et contre une surface de la plaque de test (5) transportant le composant électrique. Le contact inférieur (100) frotte contre la plaque de test (5), de manière à contribuer ainsi à l'élimination de matériau contaminant acquis par la pointe de contact (116) au cours de l'opération de l'automate de composants.
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