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Machine translation
1. (WO2006020220) SYSTEM FOR HANDLING OF WAFERS WITHIN A PROCESS TOOL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/020220    International Application No.:    PCT/US2005/025421
Publication Date: 23.02.2006 International Filing Date: 19.07.2005
IPC:
H01L 21/00
Applicants: ASM AMERICA, INC. [US/US]; 3440 East University Drive, Phoenix, AZ 85034-7200 (US) (For All Designated States Except US).
GRABOWSKI, Al, W. [US/US]; (US) (For US Only)
Inventors: GRABOWSKI, Al, W.; (US)
Agent: DELANEY, Karoline, A.; Knobbe, Martens, Olson & Bear, LLP, 2040 Main Street, 14th Floor, Irvine, CA 92614 (US)
Priority Data:
60/589,412 19.07.2004 US
Title (EN) SYSTEM FOR HANDLING OF WAFERS WITHIN A PROCESS TOOL
(FR) SYSTEME DE MANIPULATION DE PLAQUETTES DANS UN OUTIL DE TRAITEMENT
Abstract: front page image
(EN)A semiconductor process tool having a dual angled loadlock system, wherein a substrate path through each of the loadlock chambers is angled and biased toward one side through a gate valve. A wafer handling chamber is in selective communication with the loadlock chambers. The wafer handling chamber has a robot that is capable of accessing substrates in both of the loadlock chambers. A gate valve includes an insert within a wall separating the wafer handling chamber from one of the loadlocks, and a liner mounted on the insert and protruding into the wafer handling chamber.
(FR)L’invention concerne un outil de traitement de semiconducteurs doté d’un système à deux sas inclinés, dans lequel une trajectoire de substrats à travers chacun des sas est inclinée et poussée d’un côté par un robinet-vanne. Une enceinte de manipulation de plaquettes est en communication sélective avec les sas. L’enceinte de manipulation de plaquettes comprend un robot capable d’accéder aux substrats dans les deux sas. Un robinet-vanne comporte une pièce rapportée dans un paroi séparant l’enceinte de manipulation de plaquettes d’un des sas, et une chemise montée sur la pièce rapportée et faisant saillie dans l’enceinte de manipulation de plaquettes.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)