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1. (WO2006017394) METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS MADE WITH AN LCP SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/017394    International Application No.:    PCT/US2005/027013
Publication Date: 16.02.2006 International Filing Date: 01.08.2005
IPC:
G02F 1/1339 (2006.01)
Applicants: HARRIS CORPORATION [US/US]; 1025 W. Nasa Blvd., MS A-11l, Melbourne, FL 32919 (US) (For All Designated States Except US)
Inventors: SMITH, C., W., Sinjin; (US).
NEWTON, Charles, M.; (US).
JAYNES, Paul, B.; (US)
Agent: YATSKO, Michael, S.; Harris Corporation, 1025 W. Nasa Blvd., MS A-11l, Melbourne, FL 32919 (US)
Priority Data:
10/910,715 03.08.2004 US
Title (EN) METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS MADE WITH AN LCP SUBSTRATE
(FR) PROCEDE ET APPAREIL PERMETTANT DE SCELLER DES CIRCUITS IMPRIMES SOUPLES CONÇUS AU MOYEN D'UN SUBSTRAT LCP
Abstract: front page image
(EN)A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.
(FR)L'invention concerne un procédé et un appareil permettant de fixer une couche couvrante formée dans un polymère cristaux liquides sur un circuit imprimé souple comprenant des éléments montés sur un substrat de polymère cristaux liquides, de manière à renfermer les éléments entre la couche couvrante et le substrat, afin de les protéger contre une exposition à l'humidité et à des contaminants.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)