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Machine translation
1. (WO2006017345) APPARATUS FOR SUSPENDING A CHIP-SCALE DEVICE AND ATOMIC CLOCK SYSTEM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/017345    International Application No.:    PCT/US2005/024879
Publication Date: 16.02.2006 International Filing Date: 13.07.2005
IPC:
G04F 5/14 (2006.01), H01L 23/34 (2006.01), H01L 23/12 (2006.01)
Applicants: THE CHARLES STARK DRAPER LABORATORY, INC. [US/US]; 555 Technology Square, Cambridge, MA 02139 (US) (For All Designated States Except US).
MESCHER, Mark, J. [US/US]; (US) (For US Only).
VARGHESE,Mathew [IN/US]; (US) (For US Only).
WEINBERG, Marc, S. [US/US]; (US) (For US Only).
MARINIS, Thomas [US/US]; (US) (For US Only).
SOUCY, Joseph, W. [US/US]; (US) (For US Only)
Inventors: MESCHER, Mark, J.; (US).
VARGHESE,Mathew; (US).
WEINBERG, Marc, S.; (US).
MARINIS, Thomas; (US).
SOUCY, Joseph, W.; (US)
Agent: FRANK, Steven, J.; Goodwin Procter LLP, Exchange Place, Boston, MA 02109 (US)
Priority Data:
60/587,371 13.07.2004 US
Title (EN) APPARATUS FOR SUSPENDING A CHIP-SCALE DEVICE AND ATOMIC CLOCK SYSTEM
(FR) APPAREIL ET SYSTEME DE SUSPENSION D’UN DISPOSITIF DE LA TAILLE D’UNE PUCE ET PROCEDES RELATIFS
Abstract: front page image
(EN)A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.
(FR)Suspension d’un dispositif de la taille d’une puce réalisée à l’aide d’un appareil de suspension et d’au moins une première attache. L’appareil de suspension de la taille d’une puce définit un premier plan et une ouverture à travers l’appareil de suspension. Au moins une première attache traverse l’ouverture selon un premier angle par rapport au premier plan et peut servir à positionner le dispositif de la taille d’une puce au moins partiellement dans l’ouverture.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)