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1. (WO2006017005) INTERCONNECTING INTEGRATED CIRCUITS USING MEMS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2006/017005 International Application No.: PCT/US2005/022697
Publication Date: 16.02.2006 International Filing Date: 28.06.2005
IPC:
B81B 7/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
B
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
7
Micro-structural systems
Applicants: SHARMA, Manish[IN/US]; US (UsOnly)
WALMSLEY, Robert, G.[US/US]; US (UsOnly)
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.[US/US]; 20555 S. H. 249 Houston, TX 77070, US (AllExceptUS)
Inventors: SHARMA, Manish; US
WALMSLEY, Robert, G.; US
Agent: LEE, Denise, A.; Hewlett-Packard Company Intellectual Property Administration P O Box 272400 M/S 35 Fort Collins, CO 80527-2400, US
Priority Data:
10/886,97007.07.2004US
Title (EN) INTERCONNECTING INTEGRATED CIRCUITS USING MEMS
(FR) INTERCONNEXION DE CIRCUITS INTEGRES AU MOYEN DE DISPOSITIFS MEMS
Abstract:
(EN) A semiconductor device (100) comprises a plurality of integrated circuits (130a & 130b) and at least one MEMS device (110 & 120) interconnecting the integrated circuits (130a & 130b) for signal transmission between the circuits.
(FR) L'invention concerne un dispositif à semi-conducteur (100) qui comprend une pluralité de circuits intégrés (130a, 130b) et au moins un dispositif MEMS (110, 120) assurant l'interconnexion des circuits intégrés (130a, 130b) pour la transmission de signaux entre les circuits.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)