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1. (WO2006013806) EXPOSURE EQUIPMENT, EXPOSURE METHOD AND DEVICE MANUFACTURING METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2006/013806 International Application No.: PCT/JP2005/014011
Publication Date: 09.02.2006 International Filing Date: 01.08.2005
IPC:
H01L 21/027 (2006.01) ,G03F 7/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20
Exposure; Apparatus therefor
Applicants:
株式会社ニコン NIKON CORPORATION [JP/JP]; 〒1008331 東京都千代田区丸の内三丁目2番3号 Tokyo 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1008331, JP (AllExceptUS)
大和 壮一 OWA, Soichi [JP/JP]; JP (UsOnly)
長坂 博之 NAGASAKA, Hiroyuki [JP/JP]; JP (UsOnly)
菅原 龍 SUGAWARA, Ryu [JP/JP]; JP (UsOnly)
Inventors:
大和 壮一 OWA, Soichi; JP
長坂 博之 NAGASAKA, Hiroyuki; JP
菅原 龍 SUGAWARA, Ryu; JP
Agent:
川北 喜十郎 KAWAKITA, Kijuro; 〒1600022 東京都新宿区新宿一丁目5番4号 YKBマイクガーデン Tokyo YKB Mike Garden, 5-4, Shinjuku 1-chome Shinjuku-ku, Tokyo 1600022, JP
Priority Data:
2004-22722603.08.2004JP
2005-07911318.03.2005JP
Title (EN) EXPOSURE EQUIPMENT, EXPOSURE METHOD AND DEVICE MANUFACTURING METHOD
(FR) EQUIPEMENT D’EXPOSITION, PROCEDE D’EXPOSITION ET PROCEDE DE FABRICATION DE DISPOSITIF
(JA) 露光装置、露光方法及びデバイス製造方法
Abstract:
(EN) Exposure equipment (EX) is provided with a projection optical system (PL), and the projection optical system (PL) has a first optical element (LS1) which is closest to an image surface of the projection optical system (PL). The exposure equipment (EX) is provided with a first liquid immersion mechanism (1), which forms a first liquid immersion region (LR1) of a first liquid (LQ1) between an upper plane (65) of a transparent member (64) provided on the image surface side of the projection optical system (PL) and the first optical element (LS1), and is provided with an observation device (60) for observing the status of the first liquid immersion region (LR1). Optimum immersion exposure can be performed by grasping the status of the liquid immersion region of the liquid.
(FR) L’invention concerne un équipement d’exposition (EX) pourvu d’un système de projection optique (PL) comportant un premier élément optique (LS1) situé à proximité immédiate d’une surface image dudit système de projection optique (PL). L’équipement d’exposition (EX) est pourvu d’un mécanisme d’immersion dans un premier liquide (1), formant une région d’immersion dans un premier liquide (LR1) d’un premier liquide (LQ1) entre un plan supérieur (65) d’un organe transparent (64) monté du côté de la surface image du système de projection optique (PL) et le premier élément optique (LS1), et est pourvu d’un dispositif d’observation (60) pour observer l’état de la région d’immersion dans un premier liquide (LR1). Il est ainsi possible de réaliser une exposition par immersion optimale en déterminant l’état du liquide de la région d’immersion dans un liquide.
(JA)  露光装置EXは投影光学系PLを備えており、投影光学系PLは投影光学系PLの像面に最も近い第1光学素子LS1を有している。露光装置EXは、投影光学系PLの像面側に設けられた透明部材64の上面65と第1光学素子LS1との間に第1液体LQ1の第1液浸領域LR1を形成する第1液浸機構1と、第1液浸領域LR1の状態を観察する観察装置60とを備えている。液体の液浸領域の状態を把握して、最適な液浸露光を実行することができる。
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020070041553EP2226682EP1791164US20080084546CN101002299KR1020120007082
KR1020120128167EP3048485EP3258318EP3267257