WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2006012167) BOTTOM HEAT SPREADER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/012167    International Application No.:    PCT/US2005/022149
Publication Date: 02.02.2006 International Filing Date: 22.06.2005
IPC:
H01L 23/433 (2006.01), H01L 23/367 (2006.01), H01L 25/065 (2006.01)
Applicants: INTEL CORPORATION [US/US]; (a Delawere Corporation), 2200 Mission College Boulevard, Santa Clara, CA 95052 (US) (For All Designated States Except US).
HACKITT, Dale [US/US]; (US) (For US Only).
NICKERSON, Robert [US/US]; (US) (For US Only).
TAGGART, Brian [US/US]; (US) (For US Only)
Inventors: HACKITT, Dale; (US).
NICKERSON, Robert; (US).
TAGGART, Brian; (US)
Agent: VINCENT, Lester, J.; Blakely, Sokoloff, Taylor & Zafman LLP, 12400 Wilshire Boulevard, 7th Floor, Los Angeles, CA 90025 (US)
Priority Data:
10/877,586 25.06.2004 US
Title (EN) BOTTOM HEAT SPREADER
(FR) DISSIPATEUR THERMIQUE DE FOND
Abstract: front page image
(EN)Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
(FR)Les modes de réalisation de la présente invention concernent un dispositif de microélectronique pourvu d'un dissipateur thermique disposé entre un microcircuit et le substrat auquel est électriquement connecté le microcircuit. Pour un mode de réalisation de l'invention, ce dissipateur thermique est un bouchon thermique dont le coefficient de dilatation est approximativement égal à celui du microcircuit.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)