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Machine translation
1. (WO2006012139) SYSTEM AND METHOD FOR MOUNTING AN IMAGE CAPTURE DEVICE ON A FLEXIBLE SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2006/012139 International Application No.: PCT/US2005/022058
Publication Date: 02.02.2006 International Filing Date: 22.06.2005
IPC:
H04N 5/225 (2006.01)
Applicants: SINGH, Harpuneet[IN/US]; US (UsOnly)
BRATHWAITE, Nicholas, E.[US/US]; US (UsOnly)
GRAYDON, Bhret, R.[US/US]; US (UsOnly)
FLEXTRONICS INTERNATIONAL USA, INC.[US/US]; 2090 Fortune Drive San Jose, CA 95131, US (AllExceptUS)
Inventors: SINGH, Harpuneet; US
BRATHWAITE, Nicholas, E.; US
GRAYDON, Bhret, R.; US
Agent: HENNEMAN, Larry, E., Jr.; Henneman & Saunders 714 West Michigan Avenue Three Rivers, MI 49093, US
Priority Data:
10/877,81625.06.2004US
Title (EN) SYSTEM AND METHOD FOR MOUNTING AN IMAGE CAPTURE DEVICE ON A FLEXIBLE SUBSTRATE
(FR) SYSTEME ET PROCEDE PERMETTANT LE MONTAGE D'UN DISPOSITIF DE CAPTURE D'IMAGES SUR UN SUBSTRAT FLEXIBLE
Abstract: front page image
(EN) A digital camera module (200) includes an image capture device (204) mounted on a flexible circuit substrate (202). In one embodiment of the digital camera module (200), the image capture device (204) is mounted directly (e.g. by an adhesive) on the flexibl circuit substrate (202). A stiffener (206) (e.g., a piece of circuit board material) is mounted to the back of the flexible circuit substrate (202) to support wire bonding of the image capture device (204) onto the flexible circuit substrate (202) and/or to support the mountin of additional components (e.g., a lens housing).
(FR) L'invention concerne un module de caméra numérique comprenant un dispositif de capture d'images monté sur un substrat à circuit flexible. Dans une forme de réalisation de ce module, le dispositif de capture d'image est monté directement (p. ex. par un adhésif) sur le substrat à circuit flexible. Un renfort (p. ex. un morceau de matériau de carte à circuit) est monté sur l'arrière du substrat à circuit flexible afin de supporter le microcâblage connectant le dispositif de capture d'images au substrat à circuit flexible, et/ou de permettre le montage de composants additionnels (p. ex. logement d'objectif).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)