Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2006012127) MICROELECTRONIC PACKAGES AND METHODS THEREFOR
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2006/012127 International Application No.: PCT/US2005/021968
Publication Date: 02.02.2006 International Filing Date: 21.06.2005
IPC:
H01L 23/02 (2006.01) ,H01L 23/495 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
495
Lead-frames
Applicants:
HABA, Belgacem [US/US]; US (UsOnly)
BEROZ, Masud [US/US]; US (UsOnly)
KANG, Teck-Gyu [KR/US]; US (UsOnly)
KUBOTA, Yoichi [JP/US]; US (UsOnly)
KRISHNAN, Sridhar [US/US]; US (UsOnly)
RILEY, John, B., III [US/US]; US (UsOnly)
MOHAMMED, Ilyas [IN/US]; US (UsOnly)
TESSERA, INC. [US/US]; 3099 Orchard Drive San Jose, CA 95134, US (AllExceptUS)
Inventors:
HABA, Belgacem; US
BEROZ, Masud; US
KANG, Teck-Gyu; US
KUBOTA, Yoichi; US
KRISHNAN, Sridhar; US
RILEY, John, B., III; US
MOHAMMED, Ilyas; US
Agent:
DOHERTY, Michael, J. ; Lerner, David, Littenberg, Krumholz & Mentlik, LLP 600 South Avenue West Westfield, NJ 07090, US
Priority Data:
11/140/31227.05.2005US
60/583,06625.06.2004US
60/621,86525.10.2004US
Title (EN) MICROELECTRONIC PACKAGES AND METHODS THEREFOR
(FR) BOITIERS MICRO-ELECTRONIQUE ET PROCEDES CONNEXES
Abstract:
(EN) A microelectronic package (90) includes a microelectronic element (62) having faces, contacts and an outer perimeter, and a flexible substrate (42) overlying and spaced from a first face of the Microelectronic element (62), an outer region (86) of the flexible substrate (42) extending beyond the outer perimeter of the Microelectronic element (62). The package (90) includes a plurality of conductive posts (40a-40f) exposed at a surface of the flexible substrate (42) and being electrically interconnected with the microelectronic element (62), whereby at least one of the conductive posts (40a-40f) is disposed in the outer region (86) of the flexible substrate (42), and a compliant layer (74) disposed between the first face of the microelectronic element (62) and the flexible substrate (42), wherein the compliant layer (74) overlies the at least one of the conductive posts that is disposed in the outer region (86) of the flexible substrate (42). The package includes a support element (84) in contact with the microelectronic element (62) and the compliant layer (74), whereby the support element 84 overlies the outer region (86) of the flexible substrate (42).
(FR) L'invention concerne un boîtier (90) micro-électronique qui comprend un élément (62) micro-électronique possédant des faces, des contacts et un pourtour externe, et un substrat flexible (42) superposé à une première face de l'élément (62) micro-électronique et espacé de celle-ci, une zone externe (86) du substrat flexible (42) s'avançant au-delà du pourtour externe de l'élément (62) micro-électronique. Le boîtier (90) comporte une pluralité de pointes (40a-40f) conductrices exposées à la surface du substrat flexible (42) et interconnectées électriquement avec l'élément (62) micro-électronique, au moins une des pointes conductrices (40a-40f) étant disposée dans la zone externe (86) du substrat flexible (42), et une couche (74) souple disposée entre la première face de l'élément (62) micro-électronique et le substrat flexible (42), la couche (74) souple recouvrant au moins la ou les pointes conductrices disposées dans la zone externe (86) du substrat flexible (42). Le boîtier comprend un élément (84) de support qui entre en contact avec l'élément (62) micro-électronique et avec la couche (74) souple, de sorte que l'élément de support (84) est superposé à la zone externe (86) du substrat flexible (42).
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)