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Pub. No.:    WO/2006/011851    International Application No.:    PCT/SG2004/000220
Publication Date: 02.02.2006 International Filing Date: 27.07.2004
Chapter 2 Demand Filed:    12.04.2006    
H01L 29/49 (2006.01)
Applicants: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH [SG/SG]; 20 Biopolis Way, #07-01 Centros, Singapore 138668 (SG) (For All Designated States Except US).
CHI, Dongzhi [CN/SG]; (SG) (For US Only).
LEE, Ka, Yau [MY/SG]; (SG) (For US Only).
LEE, Tek, Po, Rinus [MY/SG]; (SG) (For US Only).
LIEW, Siao, Li [SG/SG]; (SG) (For US Only).
YAO, Hai, Biao [CN/SG]; (SG) (For US Only)
Inventors: CHI, Dongzhi; (SG).
LEE, Ka, Yau; (SG).
LEE, Tek, Po, Rinus; (SG).
LIEW, Siao, Li; (SG).
YAO, Hai, Biao; (SG)
Agent: CHIN, Dexter, Kam; Horizon IP Pte Ltd., 8 Kallang Sector, East Wing 7th Floor, Singapore 349282 (SG)
Priority Data:
Abstract: front page image
(EN)A nickel-based germanide contact includes a processing material that inhibits agglomeration of nickel-based germanide during processing to form the contact as well as during post-germanidation processes. The processing material is either in the form of a capping layer over the nickel layer or integrated into the nickel layer used to form the nickel-based contact. Reducing agglomeration improves electrical characteristics of the contact.
(FR)La présente invention concerne un contact en germaniure à base de nickel comprenant une matière de traitement qui empêche l'agglomération de germaniure à base de nickel lors du traitement pour former le contact et lors de processus post-germaniurisation. Cette matière de traitement se présente soit sous forme d'une couche de revêtement sur la couche de nickel, soit sous forme intégrée dans la couche de nickel qui est utilisée pour former le contact à base de nickel. Le fait de réduire l'agglomération permet d'améliorer des caractéristiques électriques dudit contact.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)