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1. (WO2006011671) LASER IRRADIATION APPARATUS AND LASER IRRADIATION METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2006/011671 International Application No.: PCT/JP2005/014264
Publication Date: 02.02.2006 International Filing Date: 28.07.2005
IPC:
H01L 21/268 (2006.01) ,H01L 21/20 (2006.01) ,H01L 29/786 (2006.01)
Applicants: TANAKA, Koichiro[JP/JP]; JP (UsOnly)
YAMAMOTO, Yoshiaki[JP/JP]; JP (UsOnly)
OMATA, Takatsugu[JP/JP]; JP (UsOnly)
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.[JP/JP]; 398, Hase, Atsugi-shi Kanagawa 243-0036, JP (AllExceptUS)
Inventors: TANAKA, Koichiro; JP
YAMAMOTO, Yoshiaki; JP
OMATA, Takatsugu; JP
Priority Data:
2004-22467630.07.2004JP
Title (EN) LASER IRRADIATION APPARATUS AND LASER IRRADIATION METHOD
(FR) APPAREIL D’IRRADIATION LASER ET PROCEDE D’IRRADIATION LASER
Abstract: front page image
(EN) It is an object of the present invention to provide a laser irradiation apparatus and a laser irradiation method for conducting a laser process homogeneously to the whole surface of a semiconductor film. A first laser beam emitted from a first laser oscillator passes through a slit and a condensing lens and then enters an irradiation surface. At the same time, a second laser beam emitted from a second laser oscillator is delivered so as to overlap the first laser beam on the irradiation surface. Further, the laser beams are scanned relative to the irradiation surface to anneal the irradiation surface homogeneously.
(FR) La présente invention concerne un appareil d’irradiation laser et un procédé d’irradiation laser pour réaliser un processus laser de manière homogène sur toute la surface d’un film semi-conducteur. Un premier faisceau laser émis à partir d’un premier oscillateur laser traverse une fente et une lentille condensatrice et ensuite entre dans une surface d’irradiation. Au même moment, un second faisceau laser émis à partir d’un second oscillateur laser est acheminé pour recouvrir le premier faisceau laser sur la surface d’irradiation. En outre, les faisceaux laser sont balayés par rapport à la surface d’irradiation pour recuire la surface d’irradiation de manière homogène.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)