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1. (WO2006004672) COMPONENTS WITH POSTS AND PADS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2006/004672 International Application No.: PCT/US2005/022753
Publication Date: 12.01.2006 International Filing Date: 24.06.2005
IPC:
H01L 23/498 (2006.01) ,H01L 23/13 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
13
characterised by the shape
Applicants:
TESSERA, INC. [US/US]; 3099 Orchard Drive San Jose, CA 95134, US (AllExceptUS)
KUBOTA, Yoichi [JP/US]; US (UsOnly)
KANG, Teck-Gyu; US (UsOnly)
PARK, Jae, M. [US/US]; US (UsOnly)
HABA, Belgacem [US/US]; US (UsOnly)
Inventors:
KUBOTA, Yoichi; US
KANG, Teck-Gyu; US
PARK, Jae, M.; US
HABA, Belgacem; US
Agent:
MILLET, Marcus, J. ; Lerner, David, Littenberg, Krumholz & Mentlik, LLP 600 South Avenue West Westfield, NJ 07090, US
Priority Data:
60/583,10925.06.2004US
Title (EN) COMPONENTS WITH POSTS AND PADS
(FR) COMPOSANTS AVEC POINTES ET TAMPONS
Abstract:
(EN) A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
(FR) L'élément microélectronique conditionné de l'invention inclut un composant de connexion intégrant une couche diélectrique (22) portant des traces (58) à distance d’une surface extérieure (26), des pointes (48) s’étendant depuis les traces et se projetant au-delà de la surface extérieure de la couche diélectrique, et des tampons (30) exposés à la surface extérieure de la couche diélectrique, les tampons étant raccordés au pointes par les traces. L’élément diélectrique surplombe la surface avant d'un élément microélectronique, et les contacts (74) exposés à la surface avant de l’élément microélectronique sont raccordés aux tampons par des fils allongés (76) tels que des fils soudés. Sont également décrits des procédés pour fabriquer un composant de connexion.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)