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Machine translation
1. (WO2005124860) MEMORY MODULE COOLING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/124860    International Application No.:    PCT/US2005/019964
Publication Date: 29.12.2005 International Filing Date: 07.06.2005
IPC:
H01L 23/367 (2006.01)
Applicants: SUN MICROSYSTEMS, INC. [US/US]; 4150 Network Circle, Santa Clara, CA 95054 (US) (For All Designated States Except US).
GATES, William, George [GB/GB]; (GB) (For US Only).
HARRIS, Richard, John [GB/GB]; (GB) (For US Only).
WRYCRAFT, Sean, Conor [GB/GB]; (GB) (For US Only)
Inventors: GATES, William, George; (GB).
HARRIS, Richard, John; (GB).
WRYCRAFT, Sean, Conor; (GB)
Agent: KIVLIN, Noel, B.; Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C., P.O. Box 398, Austin, TX 78767-0398 (US)
Priority Data:
10/867,422 14.06.2004 US
Title (EN) MEMORY MODULE COOLING
(FR) REFROIDISSEMENT DE MODULES MEMOIRE
Abstract: front page image
(EN)A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.
(FR)La présente invention se rapporte à un dissipateur pour module mémoire, qui comporte une partie de contact sensiblement plane, destinée à établir un contact thermique avec le module mémoire et à permettre le montage du dissipateur sur le module mémoire. Ledit dissipateur possède également une ou plusieurs structures émettrices de chaleur, ces dernières étant en communication thermique avec les parties de contact.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)