WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2005123867) HIGH THERMAL CONDUCTIVITY MATERIALS INCORPORATED INTO RESINS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/123867    International Application No.:    PCT/US2005/021116
Publication Date: 29.12.2005 International Filing Date: 15.06.2005
IPC:
H01B 3/00 (2006.01), C08L 101/00 (2006.01), C08K 3/00 (2006.01), C08K 7/00 (2006.01)
Applicants: SIEMENS POWER GENERATION, INC. [US/US]; 4400 Alafaya Trail, Orlando, Florida 32826-2399 (US) (For All Designated States Except US).
SMITH, James David Blackhall [US/US]; (US) (For US Only).
STEVENS, Gary [GB/GB]; (GB) (For US Only).
WOOD, John William [GB/US]; (US) (For US Only)
Inventors: SMITH, James David Blackhall; (US).
STEVENS, Gary; (GB).
WOOD, John William; (US)
Agent: SWANSON, Erik C.; Siemens Corporation-Intellectual Property Dept., 170 Wood Avenue South, Iselin, NJ 08830 (US)
Priority Data:
60/580,023 15.06.2004 US
11/152,983 14.06.2005 US
Title (EN) HIGH THERMAL CONDUCTIVITY MATERIALS INCORPORATED INTO RESINS
(FR) MATERIAUX A HAUTE CONDUCTIVITE THERMIQUE INCORPORES DANS DES RESINES
Abstract: front page image
(EN)In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 and a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the high thermal conductivity fillers are from 1-1000 nm in length and have an aspect ratio of between 3-100.
(FR)Dans un mode de réalisation, l'invention porte sur une résine à haute conductivité thermique qui comprend une matrice de résine hôte (32) et une charge à haute conductivité thermique (30). La charge à haute conductivité thermique forme un composite organique-inorganique continu avec la matrice de résine hôte, et les charges à haute conductivité thermique possèdent une longueur comprise entre 1 et 1000 nm et un facteur de forme compris entre 3 et 100.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)