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1. (WO2005123858) CHEMICAL-MECHANICAL POLISHING (CMP) SLURRY CONTAINING CLAY AND CeO2 ABRASIVE PARTICLES AND METHOD OF PLANARIZING SURFACES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/123858    International Application No.:    PCT/US2005/020716
Publication Date: 29.12.2005 International Filing Date: 14.06.2005
Chapter 2 Demand Filed:    27.10.2005    
IPC:
C09G 1/02 (2006.01), H01L 21/00 (2006.01)
Applicants: AMCOL INTERNATIONAL CORPORATION [US/US]; One North Arlington, 1500 West Shure Drive, Arlington Heights, IL 60004 (US) (For All Designated States Except US).
FANG, Mingming [US/US]; (US) (For US Only).
IANIRO, Michael, R. [US/US]; (US) (For US Only).
EISENHOUR, Don [US/US]; (US) (For US Only)
Inventors: FANG, Mingming; (US).
IANIRO, Michael, R.; (US).
EISENHOUR, Don; (US)
Agent: ANDERSON, Richard, H.; Marshall, Gerstein & Borun LLP, 6300 Sears Tower, 233 South Wacker Drive, Chicago, IL 60606 (US)
Priority Data:
10/867,337 14.06.2004 US
Title (EN) CHEMICAL-MECHANICAL POLISHING (CMP) SLURRY CONTAINING CLAY AND CeO2 ABRASIVE PARTICLES AND METHOD OF PLANARIZING SURFACES
(FR) PATE DE POLISSAGE CHIMICO-MECANIQUE (PCM) CONTENANT DES PARTICULES ABRASIVES D'ARGILE ET DE CECO2 ET PROCEDE DE PLANARISATION DE SURFACES
Abstract: front page image
(EN)A composition for planarizing or polishing a surface comprising (a) a liquid carrier, and (b) solids comprising about 0.1 to about 10% by weight clay abrasive particles, and about 0.1 % to about 50% by weight CeO2 particles, based on the total weight of solids in the composition, said clay and CeO2 abrasive particles having a particle size such that at least 90% of the particles (by number), when slurried in water, have a particle size in the range of about 10nm to about 10µm.
(FR)L'invention concerne une composition qui permet de planariser ou de polir une surface, laquelle composition comprend: (a) un support liquide, et (b) des solides comprenant de environ 0,1 % à environ 10 % en poids de particules d'argile abrasives, et de environ 0,1 % à environ 50 % en poids de particules de CeO2, sur la base du poids total des solides de la composition, lesdites particules abrasives d'argile et de CeO2 possédant une taille de particule telle qu'au moins 90 % des particules (en nombre), lorsqu'elles sont mélangées en suspension épaisse à de l'eau, possèdent une taille de particule comprise dans une plage de environ 10nm à environ 10$g(m)m.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)