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Machine translation
1. (WO2005123281) SYSTEM AND METHOD FOR CARRYING OUT LIQUID AND SUBSEQUENT DRYING TREATMENTS ON ONE OR MORE WAFERS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/123281    International Application No.:    PCT/US2005/018615
Publication Date: 29.12.2005 International Filing Date: 25.05.2005
IPC:
B08B 3/02 (2006.01), H01L 21/00 (2006.01)
Applicants: FSI INTERNATIONAL, INC. [US/US]; 3455 Lyman Boulevard, Chaska, Minnesota 55318 (US) (For All Designated States Except US).
BENSON, Arne, C. [US/US]; (US) (For US Only).
OLSON, Erik, D. [US/US]; (US) (For US Only).
SPAETH, Douglas, S. [US/US]; (US) (For US Only)
Inventors: BENSON, Arne, C.; (US).
OLSON, Erik, D.; (US).
SPAETH, Douglas, S.; (US)
Agent: PARINS, Paul, J.; KAGAN BINDER, PLLC, Suite 200, Maple Island Building, 221 Main Street North, Stillwater, Minnesota 55082 (US)
Priority Data:
10/866,916 14.06.2004 US
Title (EN) SYSTEM AND METHOD FOR CARRYING OUT LIQUID AND SUBSEQUENT DRYING TREATMENTS ON ONE OR MORE WAFERS
(FR) SYSTÈME ET MÉTHODE DE TRAITEMENT DE SÉCHAGE DE LIQUIDE SUR UNE OU PLUSIEURS GALETTES
Abstract: front page image
(EN)Systems for processing microelectronic substrates in a process chamber that incorporate improved technology for transitioning from a wet process to a dry process (especially transitioning from rinsing to drying). At least a portion of residual liquid remaining in fluid supply lines (52c, 52d) after a wet treatment is removed via a pathway (62, 64, 66) that avoids purging directly onto the substrates. Related methods are also included in the present invention.
(FR)Systèmes pour le traitement de substrats microélectroniques dans une chambre de traitement qui incorporent une technologie améliorée de transition d’un process humide à un process sec (notamment la transition entre le rinçage et le séchage). Une partie au moins du liquide résiduel restant dans les lignes d’alimentation après un traitement humide est retirée d’un passage qui évite la purge directe dans les substrats. La présente invention inclut également des méthodes afférentes.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)