WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2005122285) METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/122285    International Application No.:    PCT/US2005/019354
Publication Date: 22.12.2005 International Filing Date: 02.06.2005
Chapter 2 Demand Filed:    24.01.2006    
IPC:
H01L 21/00 (2006.01), H01L 21/20 (2006.01), H01L 21/30 (2006.01), H01L 21/326 (2006.01), H01L 21/4763 (2006.01), H01L 23/48 (2006.01), H01L 27/01 (2006.01), H01L 29/06 (2006.01), H01L 29/08 (2006.01)
Applicants: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS [US/US]; 352 Henry Administration Building, 506 S. Wright Street, Urbana, IL 61801 (US) (For All Designated States Except US).
NUZZO, Ralph, G. [US/US]; (US) (For US Only).
ROGERS, John, A. [US/US]; (US) (For US Only).
MENARD, Etienne [FR/US]; (US) (For US Only).
LEE, Keon Jae [KR/JP]; (JP) (For US Only).
KHANG, Dahl-Young [KR/US]; (US) (For US Only).
SUN, Yugang [CN/US]; (US) (For US Only).
MEITL, Matthew [US/US]; (US) (For US Only).
ZHU, Zhengtao [CN/US]; (US) (For US Only)
Inventors: NUZZO, Ralph, G.; (US).
ROGERS, John, A.; (US).
MENARD, Etienne; (US).
LEE, Keon Jae; (JP).
KHANG, Dahl-Young; (US).
SUN, Yugang; (US).
MEITL, Matthew; (US).
ZHU, Zhengtao; (US)
Agent: BARONE, Stephen, B.; 4875 Pearl East Circle, Suite 200, Boulder, CO 80301 (US)
Priority Data:
60/577,077 04.06.2004 US
60/601,061 11.08.2004 US
60/650,305 04.02.2005 US
60/663,391 18.03.2005 US
60/677,617 04.05.2005 US
Title (EN) METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
(FR) PROCEDES ET DISPOSITIFS PERMETTANT DE FABRIQUER ET D'ASSEMBLER DES ELEMENTS A SEMI-CONDUCTEUR IMPRIMABLES
Abstract: front page image
(EN)The invention provides methods and devices for fabricating printable semiconductor elements (555) and assembling printable semiconductor elements onto substrate surfaces (330). The present invention also provides stretchable semiconductor structures (760).
(FR)L'invention concerne des procédés et des dispositifs permettant de fabriquer des éléments à semiconducteur imprimables et de les assembler sur des surfaces de substrat. On décrit ainsi des procédés, dispositifs et composants de dispositifs capables de donner une large gamme d'appareils électroniques et optoélectroniques et de réseaux d'appareils flexibles sur des substrats qui renferment des matériaux polymères. On décrit enfin des structures à semiconducteur étirables et des appareils électroniques étirables capables de bonnes performances à l'état étiré. solution casting
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)