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Machine translation
1. (WO2005121266) ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/121266    International Application No.:    PCT/JP2005/010497
Publication Date: 22.12.2005 International Filing Date: 08.06.2005
IPC:
C09J 4/00 (2006.01), C09J 201/00 (2006.01), H01B 1/22 (2006.01)
Applicants: HITACHI CHEMICAL CO., LTD. [JP/JP]; 1-1, Nishi-Shinjuku 2-chome Shinjuku-ku, Tokyo 1630449 (JP) (For All Designated States Except US).
KATOGI, Shigeki [JP/JP]; (JP) (For US Only).
SUTOU, Houko [JP/JP]; (JP) (For US Only).
IZAWA, Hiroyuki [JP/JP]; (JP) (For US Only).
SHIRASAKA, Toshiaki [JP/JP]; (JP) (For US Only).
YUSA, Masami [JP/JP]; (JP) (For US Only).
KOBAYASHI, Takanobu [JP/JP]; (JP) (For US Only)
Inventors: KATOGI, Shigeki; (JP).
SUTOU, Houko; (JP).
IZAWA, Hiroyuki; (JP).
SHIRASAKA, Toshiaki; (JP).
YUSA, Masami; (JP).
KOBAYASHI, Takanobu; (JP)
Agent: HASEGAWA, Yoshiki; SOEI PATENT AND LAW FIRM Ginza First Bldg. 10-6, Ginza 1-chome, Chuo-ku, Tokyo 1040061 (JP)
Priority Data:
2004-171721 09.06.2004 JP
2004-234374 11.08.2004 JP
Title (EN) ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE
(FR) COMPOSITION ADHÉSIVE, MATÉRIAU DE CONNEXION DE CIRCUIT, STRUCTURE DE CONNEXION POUR ÉLÉMENT DE CIRCUIT, ET DISPOSITIF SEMI-CONDUCTEUR
(JA) 接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置
Abstract: front page image
(EN)Disclosed is an adhesive composition containing a thermoplastic resin, a radically polymerizable compound, a radical polymerization initiator and a radical polymerization modifier. The adhesive composition can be cured sufficiently quickly at low temperatures while exhibiting sufficiently stable adhesion strength, and has a wide process margin for curing. Also disclosed are a circuit connecting material, a connecting structure for circuit members and a semiconductor device.
(FR)Il est prévu une composition adhésive contenant une résine thermoplastique, un composé polymérisable radicalement, un initiateur de polymérisation radicale et un modificateur de polymérisation radicale. La composition adhésive peut être cuite suffisamment vite à basses températures tout en présentant une force d’adhérence suffisamment stable, avec une marge de traitement importante pour cuisson. Il est également prévu un matériau de connexion de circuit, une structure de connexion pour éléments de circuit et un dispositif semi-conducteur.
(JA) 本発明の接着剤組成物は、熱可塑性樹脂と、ラジカル重合性化合物と、ラジカル重合開始剤と、ラジカル重合調節剤と、を含有するものである。本発明によれば、低温で十分迅速に硬化処理を行うことができ、且つ硬化処理を行う際のプロセスマージンが広く、十分に安定した接着強度が得られる接着剤組成物、回路接続材料、回路部材の接続構造及び半導体装置を提供することができる。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)