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1. (WO2005121101) PHENYLNAPHTHYLIMIDAZOLES FOR USE ON COPPER SURFACES DURING SOLDERING
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2005/121101 International Application No.: PCT/JP2005/010898
Publication Date: 22.12.2005 International Filing Date: 08.06.2005
IPC:
C07D 233/58 (2006.01) ,C23F 11/14 (2006.01) ,H05K 3/28 (2006.01) ,H05K 3/34 (2006.01) ,B23K 1/00 (2006.01)
Applicants: HIRAO, Hirohiko[JP/JP]; JP (UsOnly)
KIKUKAWA, Yoshimasa[JP/JP]; JP (UsOnly)
MURAI, Takayuki[JP/JP]; JP (UsOnly)
SHIKOKU CHEMICALS CORPORATION[JP/JP]; 8-537-1, Doki-cho Higashi, Marugame-shi, Kagawa 7638504, JP (AllExceptUS)
Inventors: HIRAO, Hirohiko; JP
KIKUKAWA, Yoshimasa; JP
MURAI, Takayuki; JP
Agent: OGURI, Shohei; Eikoh Patent Office 7-13, Nishi-Shimbashi 1-chome Minato-ku, Tokyo 1050003 , JP
Priority Data:
2004-17315010.06.2004JP
2004-21823027.07.2004JP
2005-12893827.04.2005JP
Title (EN) PHENYLNAPHTHYLIMIDAZOLES FOR USE ON COPPER SURFACES DURING SOLDERING
(FR) PHÉNYLNAPHTHYLIMIDAZOLES EN VUE D’UNE UTILISATION SUR LES SURFACES EN CUIVRE AU COURS D’UN BRASAGE
Abstract: front page image
(EN) A surface treating agent containing a novel phenylnaphthylimidazole compound represented by the following formula is brought into contact with the surface of copper or a copper alloy. In the formula, when A1 is a phenyl group, then A2 represents a 1-naphthyl group or a 2-naphthyl group, and when A1 is a 1-naphthyl group or a 2-naphthyl group, then A2 represents a phenyl group; and R represents a hydrogen atom or a methyl group.
(FR) Agent de traitement de surface, contenant un nouveau composé de phénylnaphthylimidazole représenté par la formule suivante, mis en contact avec la surface de cuivre ou d’un alliage de cuivre. Dans la formule, lorsque A1 représente un groupe phényle, alors A2 représente un groupe 1-naphtyle ou un groupe 2-naphtyle, et lorsque A1 représente un groupe 1-naphtyle ou un groupe 2-naphtyle, alors A2 représente un groupe phényle ; et R représente un atome d’hydrogène ou un groupe méthyle.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)