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1. (WO2005120799) METHOD AND DEVICE FOR CONTROLLABLE ENCAPSULATION OF ELECTRONIC COMPONENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/120799    International Application No.:    PCT/NL2005/000421
Publication Date: 22.12.2005 International Filing Date: 09.06.2005
Chapter 2 Demand Filed:    11.04.2006    
IPC:
B29C 45/02 (2006.01), B29C 45/73 (2006.01), H01L 21/56 (2006.01)
Applicants: FICO B.V. [NL/NL]; Ratio 6, NL-6921 RW Duiven (NL) (For All Designated States Except US).
VENROOIJ, Johannes, Lambertus, Gerardus, Maria [NL/NL]; (NL) (For US Only)
Inventors: VENROOIJ, Johannes, Lambertus, Gerardus, Maria; (NL)
Agent: VAN DEN HEUVEL, Henricus, Theodorus; Patentwerk B.V., P.O. Box 1514, NL-5200 BN 's-Hertogenbosch (NL)
Priority Data:
1026407 11.06.2004 NL
Title (EN) METHOD AND DEVICE FOR CONTROLLABLE ENCAPSULATION OF ELECTRONIC COMPONENTS
(FR) PROCEDE ET DISPOSITIF POUR L'ENCAPSULATION CONTROLABLE DE COMPOSANTS ELECTRONIQUES
Abstract: front page image
(EN)The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mould cavity, C) filling the mould cavity, and D) curing the encapsulating material in the mould cavity. Whereby the temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature barrier (15, 16). The invention also relates to a device for encapsulating electronic components mounted on a carrier.
(FR)La présente invention a trait à un procédé pour l'encapsulation de composants électroniques montés dans un support, comprenant les étapes de traitement suivantes: A) le réchauffement de matériau d'encapsulation, B) le déplacement du matériau d'encapsulation vers une cavité de moule, C) le remplissage de la cavité de moule, et D) la cuisson du matériau d'encapsulation dans la cavité de moule. L'invention a également trait à un dispositif pour l'encapsulation de composants électronique montés sur un support.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: Dutch; Flemish (NL)