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1. (WO2005120793) MOLD RELEASE LAYER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/120793    International Application No.:    PCT/US2005/017262
Publication Date: 22.12.2005 International Filing Date: 18.05.2005
B29C 33/60 (2006.01), G03F 7/00 (2006.01), G03F 7/16 (2006.01), C03C 17/28 (2006.01)
Applicants: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US/US]; Hewlett-Packard Company, Intellectual Property Administration, 20555 S.H. 249, Houston, TX 77070 (US) (For All Designated States Except US).
KRAMER, Kenneth, M. [US/US]; (US) (For US Only).
JOHNSON, Mark, David [US/US]; (US) (For US Only)
Inventors: KRAMER, Kenneth, M.; (US).
JOHNSON, Mark, David; (US)
Agent: WADE, Matthew, L.; Hewlett-Packard Company, Intellectual Property Administration, P.O. Box 272400, Mail Stop 35, Fort Collins, CO 80527-2400 (US)
Priority Data:
10/860,865 04.06.2004 US
Abstract: front page image
(EN)A mold release layer (16’, 18’) is provided, comprising the hydrosilylation reaction product between a hydrogen-terminated silicon surface (12) and at least one compound selected from the group consisting of fluorinated terminal alkenes (16), fluorinated terminal alkynes (18), and mixtures thereof.
(FR)L'invention concerne une couche démoulante (16', 18') contenant le produit de réaction d'hydrosilylation entre une surface de silicium (12) ayant un hydrogène terminal (12) et au moins un composé sélectionné dans le groupe constitué des alcènes à terminaisons fluorées (16), des alkyles à terminaisons fluorées (18) et de leurs mélanges.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)