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Machine translation
1. (WO2005120631) USE OF ELECTRIC FIELDS TO MINIMIZE REJECTION OF IMPLANTED DEVICES AND MATERIALS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/120631    International Application No.:    PCT/US2004/017401
Publication Date: 22.12.2005 International Filing Date: 02.06.2004
IPC:
A61N 1/00 (2006.01)
Applicants: EDMAN, Carl, Frederick [US/US]; (US).
DRINAN, Darrel, Dean [US/US]; (US)
Inventors: EDMAN, Carl, Frederick; (US).
DRINAN, Darrel, Dean; (US)
Agent: MALLON, Joseph, J.; KNOBBE, MARTENS, OLSON & BEAR, LLP, 2040 Main Street, 14th Floor, Irvine, CA 92614 (US)
Priority Data:
Title (EN) USE OF ELECTRIC FIELDS TO MINIMIZE REJECTION OF IMPLANTED DEVICES AND MATERIALS
(FR) UTILISATION DE CHAMPS ELECTRIQUES DANS LA MINIMISATION DU REJET DE MATIERES ET DE DISPOSITIFS IMPLANTES
Abstract: front page image
(EN)A method to reduce fibrous capsule formation adjacent to the surface of implanted medical devices and associated apparatus for generating electrical currents (130) to reduce fibrous capsule formation. Useful in systems for long term parenteral drug delivery, fluid infusion, or analyte sampling/measurement.
(FR)L'invention concerne un procédé permettant de diminuer la formation de capsule fibreuse adjacente à la surface de dispositifs médicaux implantés et un procédé associé de génération de courants électriques (130) de manière à réduire la formation de capsule fibreuse. Ce procédé est utilisé dans des systèmes pour la distribution de médicaments parentéraux à long terme, l'infusion de liquide ou l'échantillonnage/la mesure d'analytes.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)