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Pub. No.:    WO/2005/119849    International Application No.:    PCT/US2005/018946
Publication Date: 15.12.2005 International Filing Date: 27.05.2005
H01R 4/02 (2006.01), H01R 13/24 (2006.01)
Applicants: MOLEX INCORPORATED [US/US]; 2222 Wellington Court, Lisle, IL 60532 (US) (For All Designated States Except US)
Inventors: NODA, Atsuhito; (JP).
HOSHIKAWA, Shigeyuki; (JP).
IKEDA, Hiroshi; (JP)
Agent: PAULIUS, Thomas, D.; Molex Incorporated, 2222 Wellington Court, Lisle, IL 60532 (US)
Priority Data:
60/575,347 28.05.2004 US
60/575,348 28.05.2004 US
60/614,774 30.09.2004 US
Abstract: front page image
(EN)Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (23, 80, 82) and a microelectronic device package (88). Each ring is formed to have at least one protuberance (20) on the a ring's exterior surface. The protuberance has an apex (22) or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.
(FR)Plusieurs petits anneaux creux conducteurs et flexibles (10), constitués chacun d’une matière souple, fournissent un moyen de connexion flexible à utiliser entre un substrat (23, 80, 82) et un boîtier de dispositif microélectronique (88). Chaque anneau est formé de façon à ce que sa surface extérieure présente au moins une protubérance (20). La protubérance comporte un sommet (22) ou point, qui, une fois placé contre une surface, frottera ou grattera la surface lorsque l’anneau est comprimé par une force s’exerçant radialement sur l’anneau. Le frottage d’une surface de contact sur le sommet permet d’éliminer les contaminants et la matière en couches susceptibles de perturber les signaux électriques.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)