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1. (WO2005119771) ORGANIC MATRICES CONTAINING NANOMATERIALS TO ENHANCE BULK THERMAL CONDUCTIVITY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/119771    International Application No.:    PCT/US2004/015745
Publication Date: 15.12.2005 International Filing Date: 20.05.2004
IPC:
H01L 23/373 (2006.01), H05K 1/03 (2006.01)
Applicants: GENERAL ELECTRIC COMPANY [US/US]; A New York Corporation, 1 River Road, Schenectady, NY 12345 (US) (For All Designated States Except US).
ZHONG, Hong [CN/US]; (US) (For US Only).
RUBINSZTAJN, Slawomir [US/US]; (US) (For US Only)
Inventors: ZHONG, Hong; (US).
RUBINSZTAJN, Slawomir; (US)
Agent: WINTER, Catherine, J.; Patent Counsel, General Electric Company, 3135 Easton Turnpike (W3C), Fairfield, CT 06828 (US)
Priority Data:
Title (EN) ORGANIC MATRICES CONTAINING NANOMATERIALS TO ENHANCE BULK THERMAL CONDUCTIVITY
(FR) MATRICES ORGANIQUES CONTENANT DES NANOMATIERES PERMETTANT D'AMELIORER LA CONDUCTIVITE THERMIQUE EN VRAC
Abstract: front page image
(EN)Thermal interface compositions contain nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles. In certain embodiments, a thermal interface composition (2) is positioned between a heat producing component (3) and a heat sink.
(FR)Des compositions à interface thermique contiennent des nanoparticules mélangées avec une matrice polymère. De telles compositions augmentent la conductivité thermique en vrac des composés polymères et diminuent les résistances interfaciales thermiques existant entre les matières d'interface thermique et les surfaces correspondantes. Les formulations contenant des nanoparticules montrent également une moindre séparation de phase des particules microniques par rapport aux formulations sans nanoparticules. Dans certains modes de réalisation, une composition à interface thermique (2) vient entre un composant de production de chaleur (3) et un dissipateur thermique (1).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)