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1. (WO2005119721) LIQUID METAL CONTACT MICRORELAY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/119721    International Application No.:    PCT/US2005/018552
Publication Date: 15.12.2005 International Filing Date: 27.05.2005
IPC:
H01H 29/00 (2006.01)
Applicants: AGILENT TECHNOLOGIES, INC. [US/US]; 395 Page Mill Road, Palo Alto, CA 94306 (US) (For All Designated States Except US)
Inventors: SIMON, Jonathan; (US).
ROSENAU, Steven, A.; (US)
Agent: KRAUSE-POLSTORFF, Juergen; Agilent Technologies, Inc., Intellectual Property Administration, M/S DL-429, P.O. Box 7599, Loveland, CO 80537-0599 (US)
Priority Data:
10/857,306 28.05.2004 US
Title (EN) LIQUID METAL CONTACT MICRORELAY
(FR) MICRORELAIS A CONTACT A METAL LIQUIDE
Abstract: front page image
(EN)Liquid metal microrelays (500) may be made where a contact (509) is formed by constraining a quantity of liquid metal (509) at the end of a contact support suspended over a substrate (101). Movement of the contact support typically drags the liquid metal (509) along the surface of the substrate and allows the liquid metal (509) to bridge contacts located on the substrate (101). Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.
(FR)L'invention concerne des microrelais à métal liquide dans lesquels un contact est formé en contraignant une quantité de métal liquide à se déplacer à l'extrémité d'un support de contact suspendu au-dessus d'un substrat. Le déplacement du support de contact entraîne le métal liquide le long de la surface du substrat et permet au métal liquide de ponter les contacts placés sur le substrat. Des guides d'ondes coplanaires peuvent être utilisés pour le signal commuté au lieu de lignes de transmission microruban, en vue de réduire les discontinuités des lignes de transmission dues aux variations d'impédance.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)