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Machine translation
1. (WO2005119204) PROBE HEAD MANUFACTURING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/119204    International Application No.:    PCT/JP2005/010067
Publication Date: 15.12.2005 International Filing Date: 01.06.2005
Chapter 2 Demand Filed:    03.04.2006    
IPC:
G01Q 10/00 (2010.01), G01Q 70/14 (2010.01), G01Q 70/16 (2010.01), G01Q 80/00 (2010.01)
Applicants: PIONEER CORPORATION [JP/JP]; 4-1, Meguro 1-chome, Meguro-ku, Tokyo 1538654 (JP) (For All Designated States Except US).
TAKAHASHI, Hirokazu [JP/JP]; (JP) (For US Only).
ONO, Takahito [JP/JP]; (JP) (For US Only).
ESASHI, Masayoshi [JP/JP]; (JP)
Inventors: TAKAHASHI, Hirokazu; (JP).
ONO, Takahito; (JP).
ESASHI, Masayoshi; (JP)
Agent: EGAMI, Tatsuo; c/o TOKYO CENTRAL PATENT FIRM 4th Floor, Oak Building Kyobashi 16-10, Kyobashi 1-chome Chuou-ku, Tokyo 1040031 (JP)
Priority Data:
2004-167170 04.06.2004 JP
Title (EN) PROBE HEAD MANUFACTURING METHOD
(FR) PROCÉDÉ DE FABRICATION D’UNE TÊTE DE SONDE
(JA) プローブヘッドの製造方法
Abstract: front page image
(EN)A beam (32) of a probe head (30) having a uniform thickness is formed by using a silicon layer (64) of an SOI substrate. The beam of the probe head is formed by growing a boron-doped diamond and a non-doped diamond on a processing board, respectively.
(FR)Un faisceau (32) d’une tête de sonde (30) ayant une grosseur uniforme est formé en utilisant une couche de silicone (64) d’un substrat de SOI. Le faisceau de la tête de sonde est formé en faisant croître respectivement du diamant dopé au bore et du diamant non dopé sur carte de traitement.
(JA) SOI基板のシリコン層64を用いて、均一な厚さを有するプローブヘッド30の梁32を形成する。また、ボロンドープダイヤモンドおよびノンドープダイヤモンドを加工基板上でそれぞれ成長させることにより、プローブヘッドの梁を形成する。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)