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Machine translation
1. (WO2005117211) IMPROVED GROUNDING OF ELECTRICAL STRUCTURES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/117211    International Application No.:    PCT/US2005/016305
Publication Date: 08.12.2005 International Filing Date: 10.05.2005
Chapter 2 Demand Filed:    28.11.2005    
IPC:
H02H 3/00 (2006.01)
Applicants: FORWARD VENTURES, LP [US/US]; 2201 N. Collins, Suite 240, Arlington, TX 76011 (US) (For All Designated States Except US).
KIRBY, Norman, R. [US/US]; (US) (For US Only).
HANNAY, Richard, C. [US/US]; (US) (For US Only).
TIAN, Fu [CN/US]; (US) (For US Only).
COFFER, Walter [US/US]; (US) (For US Only)
Inventors: KIRBY, Norman, R.; (US).
HANNAY, Richard, C.; (US).
TIAN, Fu; (US).
COFFER, Walter; (US)
Agent: CATENA, Gino; Fulbright & Jaworski L.L.P., Fulbright Tower, 1301 McKinney, Suite 5100, Houston, TX 77010-3095 (US)
Priority Data:
10/851,839 21.05.2004 US
Title (EN) IMPROVED GROUNDING OF ELECTRICAL STRUCTURES
(FR) MISE A LA TERRE AMELIOREE DE STRUCTURES ELECTRIQUES
Abstract: front page image
(EN)Placement of a conductive polymer composition grounding material at frequent points in an integrated electric transmission and distribution system to minimize transmission of harmonics and the resulting electrical losses is described.
(FR)Cette invention concerne la mise en place d'un matériau de mise à la terre à base d'une composition polymère conductrice en de multiples points d'un système intégré de transmission et de distribution électrique dans le but de réduire la transmission d'harmoniques et les pertes électriques concomitantes.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)