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1. (WO2005117092) STACKED SEMICONDUCTOR PACKAGE HAVING ADHESIVE/SPACER STRUCTURE AND INSULATION

Pub. No.:    WO/2005/117092    International Application No.:    PCT/US2005/017670
Publication Date: Fri Dec 09 00:59:59 CET 2005 International Filing Date: Sat May 21 01:59:59 CEST 2005
IPC: H01L 23/34
Applicants: CHIPPAC, INC.
KWON, Hyeog Chan
KARNEZOS, Marcos
Inventors: KWON, Hyeog Chan
KARNEZOS, Marcos
Title: STACKED SEMICONDUCTOR PACKAGE HAVING ADHESIVE/SPACER STRUCTURE AND INSULATION
Abstract:
stacked semiconductor assemblies in which a device such as a die, or a package, or a heat spreader is stacked over a first wire-bonded die. An adhesive/spacer structure is situated between the first wire-bonded die and the device stacked over it, and the device has an electrically non-conductive surface facing the first wire-bonded die. That is, the first die is mounted active side upward on a first substrate and is electrically interconnected to the substrate by wire bonding; an adhesive/spacer structure is formed upon the active side of the first die; and a device such as a die or a package or a heat spreader, having an electrically nonconductive side, is mounted upon the adhesive/spacer structure with the electrically nonconductive side facing the first wire bonded die. The side of the device facing the first wire bonded die may be made electrically nonconductive by having an electrically insulating layer, such as a dielectric film adhesive. Also, methods for making the assemblies are disclosed.