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Machine translation
1. (WO2005115729) STRUCTURALLY INTEGRATED CIRCUIT AND ASSOCIATED METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/115729    International Application No.:    PCT/US2005/016200
Publication Date: 08.12.2005 International Filing Date: 09.05.2005
IPC:
B29C 70/88 (2006.01), B29C 70/68 (2006.01), B29C 70/86 (2006.01), H01B 7/00 (2006.01), B64C 27/473 (2006.01)
Applicants: THE BOEING COMPANY [US/US]; 100 North Riverside Plaza, Chicago, IL 60606 (US) (For All Designated States Except US).
MARSHALL, Joseph, A. [US/US]; (US) (For US Only).
WEEMS, Douglas, B. [US/US]; (US) (For US Only).
BUSSOM, Richard, C. [US/US]; (US) (For US Only).
ANDERSON, David, M. [US/US]; (US) (For US Only)
Inventors: MARSHALL, Joseph, A.; (US).
WEEMS, Douglas, B.; (US).
BUSSOM, Richard, C.; (US).
ANDERSON, David, M.; (US)
Agent: SAVAGE, Laurence, A.; The Boeing Company, 15460 Laguna Canyon Road, MC 1650-7006, Irvine, CA 92618 (US)
Priority Data:
10/848,703 19.05.2004 US
Title (EN) STRUCTURALLY INTEGRATED CIRCUIT AND ASSOCIATED METHOD
(FR) CIRCUIT STRUCTURALEMENT INTEGRE ET PROCEDE CONNEXE
Abstract: front page image
(EN)A composite structural member (10) with an integrated electrical circuit and an associated method of manufacture are provided. The structural member includes a plurality of layers (12, 14, 16) of structural reinforcement material, and two or more electrical devices(20, 22) are disposed at least partially between the layers with an intermediate layer (14) of the structural reinforcement material disposed between the electrical devices. At least one electrical bus (30, 32, 34, 36) is disposed in the structural member, and each electrical device is connected to the bus by a conductive electrode (40, 42, 44, 46). Thus, the electrodes (40, 42, 44, 46) can extend through the intermediate layer of the structural reinforcement material to connect each of the electrical devices to one or more of the buses (30, 32, 34, 36).
(FR)Cette invention concerne un élément structural composite (10) à circuit électrique intégré et un procédé de fabrication connexe. L'élément structural comprend une pluralité de couches (12, 14, 16) faites d'un matériau de renforcement structurel, deux dispositifs électriques ou plus (20, 22) étant disposés au moins partiellement entre les couches et étant eux-mêmes séparés par une couche iintermédiaire (14) de matériau de renforcement structural. On trouve au moins un bus électrique (30, 32, 34, 36) dans l'élément structurel, ce dernier étant connecté au bus par une électrode conductrice (40, 42, 44, 46). Ainsi, les électrodes peuvent traverser la couche intermédiaire de matériau de renforcement structural et connecter chacun des dispositifs électriques au/aux bus (30, 32, 34, 36).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)