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Machine translation
1. (WO2005105919) RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE SEALED WITH RESIN
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/105919    International Application No.:    PCT/JP2005/008324
Publication Date: 10.11.2005 International Filing Date: 25.04.2005
IPC:
C08K 7/06 (2006.01), C08L 63/00 (2006.01), H01L 23/29 (2006.01), H01L 23/31 (2006.01)
Applicants: KUREHA CORPORATION [JP/JP]; 3-3-2, Nihonbashi-Hamacho, Chuo-ku, Tokyo, 1038552 (JP) (For All Designated States Except US).
NISHIHATA, Naomitsu [JP/JP]; (JP) (For US Only)
Inventors: NISHIHATA, Naomitsu; (JP)
Agent: NISHIKAWA, Shigeaki; Visual City 401 43-9, Higashi-Nippori 3-chome Arakawa-ku Tokyo, 1160014 (JP)
Priority Data:
2004-135324 30.04.2004 JP
Title (EN) RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE SEALED WITH RESIN
(FR) COMPOSITION DE RESINE POUR L'ÉTANCHÉITÉ ET DISPOSITIF SEMICONDUCTEUR ÉTANCHÉIFIÉ AVEC LA RÉSINE
(JA) 封止用樹脂組成物及び樹脂封止された半導体装置
Abstract: front page image
(EN)Disclosed is a resin composition for sealing which contains 100 parts by weight of a synthetic resin, 10-500 parts by weight of a carbon precursor having a volume resistivity of 102-1010 Ω·cm, 0-60 parts by weight of a conductive filler having a volume resistivity of less than 102 Ω·cm, and 100-1,500 parts by weight of an other inorganic filler.
(FR)Il est divulgué une composition de résine pour l'étanchéité qui contient 100 parts pondérales d'une résine synthétique, de 10-500 parts pondérales d'un précurseur de carbone ayant une résistivité de volume de 102-1010 Ω·cm, 0-60 parts pondérales d'une charge conductrice ayant une résistivité de volume inférieure á 102 Ω·cm, et100-1,500 parts pondérales d'une autre charge inorganique.
(JA)合成樹脂100重量部、体積抵抗率が10~1010Ω・cmの炭素前駆体10~500重量部、体積抵抗率が10Ω・cm未満の導電性充填剤0~60重量部、及びその他の無機充填剤100~1500重量部を含有する封止用樹脂組成物。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)