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1. (WO2005104216) PROCESSING SYSTEM AND METHOD FOR TREATING A SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/104216    International Application No.:    PCT/US2005/004037
Publication Date: 03.11.2005 International Filing Date: 08.02.2005
IPC:
H01L 21/66 (2006.01)
Applicants: TOKYO ELECTRON LIMITED [JP/JP]; TBS Broadcast Center, 3-6, Akasak 5-chome, Minato-ku, Tokyo 107 (JP) (For All Designated States Except US).
HIGUCHI, Fumihiko [JP/JP]; (JP) (For US Only).
TAKAHASHI, Hiroyuki [JP/US]; (US) (For US Only).
KO, Akiteru [JP/US]; (US) (For US Only).
YUE, Hongyu [CN/US]; (US) (For US Only).
YAMASHITA, Asao [JP/US]; (US) (For US Only).
KAMBARA, Hiromitsu [JP/US]; (US) (For US Only)
Inventors: HIGUCHI, Fumihiko; (JP).
TAKAHASHI, Hiroyuki; (US).
KO, Akiteru; (US).
YUE, Hongyu; (US).
YAMASHITA, Asao; (US).
KAMBARA, Hiromitsu; (US)
Agent: KARCESKI, Jeffrey, D.; Pillsbury Winthrop LLP, P.O. 10500, McLean, VA 22102 (US)
Priority Data:
10/812,347 30.03.2004 US
Title (EN) PROCESSING SYSTEM AND METHOD FOR TREATING A SUBSTRATE
(FR) SYSTEME DE TRAITEMENT ET PROCEDE POUR TRAITER UN SUBSTRAT
Abstract: front page image
(EN)A method and system for trimming a feature on a substrate is described. During a chemical treatment of the substrate, the substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. An inert gas is also introduced, and the flow rate of the inert gas is selected in order to affect a target trim amount during the trimming of the feature.
(FR)L'invention concerne un procédé et un système d'ajustage d'un élément sur un substrat. Au cours d'un traitement chimique du substrat, le substrat est exposé à un produit de traitement gazeux, tel que HF/NH3, dans des conditions contrôlées notamment de température de surface et de pression du gaz. Un gaz inerte est également introduit et le débit du gaz inerte est sélectionné de manière à affecter une quantité d'ajustage cible au cours de l'ajustage de l'élément.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)