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Machine translation
1. (WO2005104188) POLYMER DIELECTRICS FOR MEMORY ELEMENT ARRAY INTERCONNECT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/104188    International Application No.:    PCT/US2005/004680
Publication Date: 03.11.2005 International Filing Date: 11.02.2005
IPC:
H01L 21/00 (2006.01), H01L 23/58 (2006.01), H01L 29/08 (2006.01), H01L 51/40 (2006.01), H01L 21/31 (2006.01), H01L 27/00 (2006.01)
Applicants: ADVANCED MICRO DEVICES, INC. [US/US]; One AMD Place, Mail Stop 68, P.O. Box 3453, Sunnyvale, CA 94088-3453 (US) (For All Designated States Except US).
LYONS, Christopher, F. [US/US]; (US) (For US Only)
Inventors: LYONS, Christopher, F.; (US)
Agent: DRAKE, Paul, S.; One AMD Place, Mail Stop 68, P.O. Box 3453, Sunnyvale, CA 94088-3453 (US)
Priority Data:
10/817,467 02.04.2004 US
Title (EN) POLYMER DIELECTRICS FOR MEMORY ELEMENT ARRAY INTERCONNECT
(FR) DIELECTRIQUES POLYMERES POUR INTERCONNEXION DE RESEAU DE POINTS MEMOIRE
Abstract: front page image
(EN)Disclosed are semiconductor devices (100) containing a polymer dielectric (103) and at least one active device (104) containing an organic semiconductor material (112) and a passive layer (114). Also disclosed are semiconductor devices (100) further containing a conductive polymer (106 and/or 108). Such devices are characterized by light weight and robust reliability.
(FR)L'invention concerne des dispositifs à semi-conducteurs (100) contenant un diélectrique polymère (103) et au moins un dispositif actif (104) contenant un matériau semi-conducteur organique (112) et une couche passive (114). L'invention concerne également des dispositifs à semi-conducteurs (100) contenant en outre un polymère conducteur (106 et/ou 108). Lesdits dispositifs sont caractérisés par un poids léger et une fiabilité robuste.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)