Processing

Please wait...

Settings

Settings

Goto Application

1. WO2005100899 - MULTIPLE EVAPORATOR HEAT PIPE ASSISTED HEAT SINK

Publication Number WO/2005/100899
Publication Date 27.10.2005
International Application No. PCT/US2005/011633
International Filing Date 07.04.2005
IPC
F28F 7/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
7Elements not covered by group F28F1/, F28F3/, or F28F5/121
F28D 15/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
CPC
F28D 15/0233
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0233the conduits having a particular shape, e.g. non-circular cross-section, annular
F28D 15/0266
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0266with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
F28D 15/0275
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
F28D 2021/0029
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
21Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
0028for cooling heat generating elements, e.g. for cooling electronic components or electric devices
0029Heat sinks
F28F 3/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
Applicants
  • AAVID THERMALLOY, LLC [US]/[US] (AllExceptUS)
Inventors
  • WHITNEY, Bradley, Robert
Agents
  • WEISZ, Edward, M.
Priority Data
60/560,86909.04.2004US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MULTIPLE EVAPORATOR HEAT PIPE ASSISTED HEAT SINK
(FR) PUITS THERMIQUE ASSORTI D'UN CALODUC A EVAPORATEURS MULTIPLES
Abstract
(EN)
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions received in parallel channels in the base plate. A wall upstanding from the base plate between the channels is formed with an upright channel which receives the condenser portion substantially within the profile of the wall, so that a plurality of horizontal cooling fins can be fixed to the wall in thermal contact with the condenser portion.
(FR)
Puits thermique comprenant une plaque de base disposée contre un composant à refroidir, et un caloduc en forme de boucle dont la partie condenseur s'élève verticalement de la plaque de base et dont la paire d'extrémités forme une paire d'éléments d'évaporateur logés dans des fentes parallèles de la plaque de base. Une cloison partant verticalement de la plaque de base entre les fentes comporte un profilé en U abritant la partie condenseur sensiblement à l'intérieur du profil de la cloison de sorte qu'une pluralité d'ailettes de refroidissement horizontales peut être fixée à la cloison en contact avec la partie condenseur.
Latest bibliographic data on file with the International Bureau