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1. WO2005100636 - TECHNIQUES FOR PACKAGING AND ENCAPSULATING COMPONENTS OF DIAGNOSTIC PLASMA MEASUREMENT DEVICES

Publication Number WO/2005/100636
Publication Date 27.10.2005
International Application No. PCT/US2005/009581
International Filing Date 21.03.2005
IPC
C23F 1/00 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES; INHIBITING CORROSION OF METALLIC MATERIAL; INHIBITING INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25247
1Etching metallic material by chemical means
CPC
H01J 37/32082
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
32082Radio frequency generated discharge
H01J 37/32935
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
32917Plasma diagnostics
32935Monitoring and controlling tubes by information coming from the object and/or discharge
Applicants
  • ADVANCED ENERGY INDUSTRIES, INC. [US]/[US] (AllExceptUS)
Inventors
  • CARTER, Daniel, C.
  • DORAN, Daniel, B.
  • MAHONEY, Leonard, J.
Agents
  • PIRNOT, John, D.
Priority Data
10/815,12431.03.2004US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) TECHNIQUES FOR PACKAGING AND ENCAPSULATING COMPONENTS OF DIAGNOSTIC PLASMA MEASUREMENT DEVICES
(FR) TECHNIQUES D'EMBALLAGE ET D'ENCAPSULATION DE COMPOSANTS DE DISPOSITIFS DE MESURES DIAGNOSTIQUES DE PLASMA
Abstract
(EN)
An in-situ plasma measurement probe comprises a primary substrate, such as a silicon wafer, with sensor devices disposed about the surface of the probe. An electronics module contains electronic components or other elements of the diagnostic probe that require isolation and shielding from the plasma environment. The electronics module is disposed upon the probe substrate and electrically connected to the remote sensor devices through one or more electrical interconnection layers disposed upon the substrate. By integrating and modularizing the electronic components of a sensor probe, the probe design may be optimized for cost effective production techniques while ensuring mechanical, chemical, and thermal compatibility with the wafer or other carrying substrate and the environment to which it is exposed.
(FR)
Une sonde de mesure de plasma in situ comprend un substrat principal, tel qu'une plaquette de silicium, avec des dispositifs capteurs placés autour de la surface de la sonde. Un module d'éléments électroniques contient des composants électroniques et d'autres éléments de cette sonde diagnostique qui nécessitent une isolation et une protection de l'environnement de plasma. Ce module d'éléments électroniques est placé sur le substrat de sonde et connecté électriquement aux dispositifs capteurs distants via une ou plusieurs couches d'interconnexion électrique placées sur le substrat. Par l'intégration et la modularisation des composants électroniques d'une sonde de détection, cette conception de sonde peut être optimisée pour des techniques de production rentables tout en assurant une compatibilité mécanique, chimique et thermique avec la plaquette ou avec un autre substrat porteur et avec l'environnement auquel elle est exposée.
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