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1. WO2005098088 - ELECTROLESS GOLD PLATING LIQUID

Publication Number WO/2005/098088
Publication Date 20.10.2005
International Application No. PCT/JP2005/005936
International Filing Date 29.03.2005
IPC
C23C 18/44 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
42Coating with noble metals
44using reducing agents
CPC
C23C 18/44
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
42Coating with noble metals
44using reducing agents
Applicants
  • NIPPON MINING & METALS CO., LTD. [JP]/[JP] (AllExceptUS)
  • 日野 英治 HINO, Eiji [JP]/[JP] (UsOnly)
  • 熊谷 正志 KUMAGAI, Masashi [JP]/[JP] (UsOnly)
Inventors
  • 日野 英治 HINO, Eiji
  • 熊谷 正志 KUMAGAI, Masashi
Agents
  • 酒井 正己 SAKAI, Masami
Priority Data
2004-11063005.04.2004JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTROLESS GOLD PLATING LIQUID
(FR) LIQUIDE DE DORURE PAR IMMERSION
(JA) 無電解金めっき液
Abstract
(EN)
Disclosed is an electroless gold plating liquid with excellent stability which has a practically sufficient deposition rate without containing heavy metal ions such as thallium ions. Specifically disclosed is an electroless gold plating liquid characterized by containing a noncyanic gold salt as a gold salt, an alkali metal salt or ammonium salt of sulfurous acid and thiosulfuric acid as a complexing agent for gold, a hydroxyalkyl sulfonic acid represented by the general formula below or a salt thereof as a reducing agent, and an amine compound. Formula (In the above formula, R represents a hydrogen, a carboxy group, an optionally substituted phenyl group, a tolyl group, a naphthyl group, a saturated or unsaturated alkyl group, an acetyl group, an acetonyl group, a pyridyl group or a furyl group; X represents a hydrogen, Na, K or NH4, and n represents an integer of 0-4.)
(FR)
Il est prévu un liquide de dorure par immersion d’une excellente stabilité, avec une vitesse de dépôt pratiquement suffisante sans contenir de ions de métal lourd comme des ions de thallium. Il est prévu spécifiquement un liquide de dorure par immersion caractérisé en ce qu'il contient un sel d’or non cyanique comme sel d’or, un sel de métal alcalin ou un sel d’ammonium d’acide sulfurique et d’acide thiosulfurique comme agent complexant pour l’or, un acide hydroxyalkyle sulfonique représenté par la formule générale ci-dessous ou bien un sel de celui-ci comme agent réducteur, et un composé aminé. Formule (Dans la formule ci-dessus, R représente un hydrogène, un groupe carboxy, un groupe phényle substitué en option, un groupe tolyle, un groupe naphtyle, un groupe alkyle saturé ou non saturé, un groupe acétyle, un groupe acétonyle, un groupe pyridyle ou un groupe furyle ; X représente un hydrogène, Na, K ou NH4, et n représente un entier de 0 à 4).
(JA)
 タリウム等の重金属イオンを含まなくても実用上十分な析出速度を有し、まためっき液の安定性にも優れた無電解金めっき液を提供することを目的とする。  金塩として非シアン系金塩、金の錯化剤として亜硫酸およびチオ硫酸のアルカリ金属塩又はアンモニウム塩、還元剤としての下記一般式で表されるヒドロキシアルキルスルホン酸又はその塩と、アミン化合物とを含有することを特徴とする無電解金めっき液。   【化1】 (上記式中、Rは水素、カルボキシ基、又は置換基を有していてもよいフェニル基、トリル基、ナフチル基、飽和または不飽和アルキル基、アセチル基、アセトニル基、ピリジル基、及びフリル基のいずれかを表わし、Xは水素、Na、K、及びNH4のいずれかを表わし、nは0~4の整数である。)
Also published as
US2007095249
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