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1. WO2005093830 - HEAT EXCHANGER

Publication Number WO/2005/093830
Publication Date 06.10.2005
International Application No. PCT/EP2005/002680
International Filing Date 14.03.2005
IPC
H01L 23/367 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
F28F 3/048
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
04the means being integral with the element
048in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
F28F 3/12
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
12Elements constructed in the shape of a hollow panel, e.g. with channels
F28F 9/0246
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
9Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
02Header boxes; End plates
0246Arrangements for connecting header boxes with flow lines
F28F 9/0253
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
9Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
02Header boxes; End plates
0246Arrangements for connecting header boxes with flow lines
0251Massive connectors, e.g. blocks; Plate-like connectors
0253with multiple channels, e.g. with combined inflow and outflow channels
F28F 9/028
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
9Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
02Header boxes; End plates
026with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
028by using inserts for modifying the pattern of flow inside the header box, e.g. by using flow restrictors or permeable bodies or blocks with channels
H01L 23/4735
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
4735Jet impingement
Applicants
  • EBM-PAPST ST. GEORGEN GMBH & CO. KG [DE]/[DE] (AllExceptUS)
  • LAUFER, Wolfgang [DE]/[DE] (UsOnly)
  • ANGELIS, Walter, Georg [DE]/[DE] (UsOnly)
  • SEIDLER, Siegfried [DE]/[DE] (UsOnly)
  • WEISSER, Norbert [DE]/[DE] (UsOnly)
  • THREN, Christian [DE]/[DE] (UsOnly)
Inventors
  • LAUFER, Wolfgang
  • ANGELIS, Walter, Georg
  • SEIDLER, Siegfried
  • WEISSER, Norbert
  • THREN, Christian
Agents
  • RAIBLE, Hans
Priority Data
20 2004 005 241.526.03.2004DE
20 2004 019 084.227.11.2004DE
20 2004 019 852.515.12.2004DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) WÄRMETAUSCHER
(EN) HEAT EXCHANGER
(FR) ECHANGEUR DE CHALEUR
Abstract
(DE)
Die Erfindung betrifft einen Wärmeaufnehmer zur Aufnahme von Wärme aus einem Bauteil, und zur Wärmeabfuhr mittels eines Kühlfluids (36), welcher Wärmeaufnehmer aufweist: Ein Zufuhrelement (56') zur Zufuhr von Kühlfluid (36) zum Wärmeaufnehmer; ein Abfuhrelement (62') zur Abfuhr von Kühlfluid (36) vom Wärmeaufnehmer; eine Wärmesenke (68'), bei der eine Seite zur Aufnahme von Wärme ausgebildet ist, und eine andere, in Betrieb mit dem Kühlfluid (36) in Kontakt stehende Seite mit einer muldenförmigen, durch einen Rand begrenzten Vertiefung versehen ist, in welcher eine Mehrzahl von Wärmeleitelementen (84') angeordnet ist, die an ihren der muldenförmigen Vertiefung zugewandten Enden mit dem Boden dieser Vertiefung Wärme leitend verbunden sind, und deren freie Enden von der muldenförmigen Vertiefung weg ragen; wobei das Zufuhrelement (56') dazu ausgebildet ist, im Betrieb der muldenförmigen Vertiefung Kühlfluid im Bereich von deren tiefsten Stelle zuzuführen, und dazu mindestens eine Austrittsöffnung (58') aufweist, die in einem vorgegebenen Mindest-Abstand von den freien Enden der Wärmeleitelemente (84') angeordnet ist.
(EN)
The invention relates to a heat absorption device for absorbing heat from a component and for dissipating heat by means of a cooling fluid (36). Said heat absorption device comprises the following elements: a supply element (56') for supplying the heat absorbing device with a cooling fluid (36); a dissipation element (62') for dissipating the cooling fluid (36) from the heat absorption device; and a heat sink (68'), whose one side is adapted to absorb heat and whose other side contacts the cooling fluid (36) during operation and has a trough-shaped recess delimited by an edge. In said recess, a plurality of heat guiding elements (84') are arranged which are linked with their ends facing the trough-shaped recess with the bottom of said recess and whose free ends project away from the trough-shaped recess. The supply element (56') is adapted to supply, during operation, the trough-shaped recess with the cooling fluid in the area of the lowest point thereof. For this purpose, the supply element has at least one outlet (58') that is arranged at a predetermined minimum distance from the free ends of the heat guiding elements (84').
(FR)
L'invention concerne un absorbeur de chaleur destiné à absorber la chaleur d'un composant, et à évacuer la chaleur à l'aide d'un fluide de refroidissement (36). Cet absorbeur de chaleur comprend un élément d'alimentation (56') destiné à l'alimentation de l'absorbeur de chaleur en fluide de refroidissement (36); un élément d'évacuation (62') destiné à l'évacuation du fluide de refroidissement (36) de l'absorbeur de chaleur; un puits thermique (68') dont un côté est destiné à l'absorption de la chaleur, et l'autre côté qui, en mode de fonctionnement, est en contact avec le fluide de refroidissement (36), a un évidement en forme d'auge délimité par le bord et dans lequel est placée une pluralité d'éléments thermoconducteurs (84'). Ces éléments thermoconducteurs sont, à leurs extrémités tournées vers l'évidement en forme d'auge, reliés de manière thermoconductrice au fond de cet évidement, et leurs extrémités libres émergent de l'évidement en forme d'auge. L'élément d'alimentation (56') est réalisé de telle façon qu'en mode de fonctionnement, le fluide de refroidissement est cédé à l'évidement en forme d'auge en son point le plus profond et présente à cet effet au moins un orifice de sortie (58') qui est situé à une distance minimale prédéterminée des extrémités libres des élément thermoconducteurs (84').
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