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1. WO2005085408 - IMPROVED ALKALINE CHEMISTRY FOR POST-CMP CLEANING

Publication Number WO/2005/085408
Publication Date 15.09.2005
International Application No. PCT/IB2005/000081
International Filing Date 12.01.2005
IPC
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
1
Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
38
Cationic compounds
62
Quaternary ammonium compounds
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
02
Inorganic compounds
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
16
Organic compounds
20
containing oxygen
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
16
Organic compounds
20
containing oxygen
22
Carbohydrates or derivatives thereof
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
16
Organic compounds
26
containing nitrogen
28
Heterocyclic compounds containing nitrogen in the ring
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
16
Organic compounds
26
containing nitrogen
30
Amines; Substituted amines
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
16
Organic compounds
26
containing nitrogen
32
Amides; Substituted amides
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
16
Organic compounds
26
containing nitrogen
33
Amino carboxylic acids
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3
Other compounding ingredients of detergent compositions covered in group C11D1/101
16
Organic compounds
34
containing sulfur
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7
Compositions of detergents based essentially on non-surface-active compounds
02
Inorganic compounds
04
Water-soluble compounds
06
Hydroxides
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7
Compositions of detergents based essentially on non-surface-active compounds
22
Organic compounds
26
containing oxygen
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7
Compositions of detergents based essentially on non-surface-active compounds
22
Organic compounds
32
containing nitrogen
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7
Compositions of detergents based essentially on non-surface-active compounds
22
Organic compounds
34
containing sulfur
C CHEMISTRY; METALLURGY
11
ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D
DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
11
Special methods for preparing compositions containing mixtures of detergents
C11D 1/62 (2006.01)
C11D 3/00 (2006.01)
C11D 3/02 (2006.01)
C11D 3/20 (2006.01)
C11D 3/22 (2006.01)
C11D 3/28 (2006.01)
CPC
C11D 1/62
C11D 11/0047
C11D 3/0073
C11D 3/044
C11D 3/2068
C11D 3/2072
Applicants
  • L'AIR LIQUIDE-SOCIETE ANONYME A DIRECTOIRE ET CONSEIL DE SURVEILLANCE POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE [FR/FR]; 75, quai d'Orsay F-75321 Paris Cedex 07, FR (AllExceptUS)
  • FISHER, Matthew, L. [US/US]; US (UsOnly)
  • MISRA, Ashutosh [IN/US]; US (UsOnly)
Inventors
  • FISHER, Matthew, L.; US
  • MISRA, Ashutosh; US
Priority Data
10/956,27301.10.2004US
60/544,27212.02.2004US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) IMPROVED ALKALINE CHEMISTRY FOR POST-CMP CLEANING
(FR) PROCESSUS CHIMIQUE ALCALIN AMELIORE DE NETTOYAGE POST-PLANARISATION MECANO-CHIMIQUE
Abstract
(EN)
This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer.
(FR)
L'invention concerne le nettoyage de plaquettes semiconductrices intervenant après la planarisation mécano-chimique (CMP) desdites plaquettes, pendant la fabrication de dispositifs semiconducteurs. L'invention concerne également un processus chimique alcalin permettant le nettoyage post-planarisation mécano-chimique de plaquettes comportant des interconnexions métalliques, en particulier en cuivre. Des particules en suspension résiduelle, en particulier de cuivre ou d'autres métaux, sont éliminées de la surface de la plaquette sans gravure significative du métal, les dépôts étant laissés sur la surface, et sans induire de contamination significative de la plaquette, le métal étant en même temps protégé contre l'oxydation et la corrosion. Au moins un agent chélateur puissant est également contenu dans une solution d'ions métalliques complexes, ce qui facilite l'élimination du métal du diélectrique et empêche le redépôt sur la plaquette.
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