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1. WO2005069390 - THERMOELECTRIC DEVICES

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Publication Number WO/2005/069390
Publication Date 28.07.2005
International Application No. PCT/US2005/000937
International Filing Date 12.01.2005
IPC
H01L 35/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
H01L 35/30 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
30characterised by the heat-exchanging means at the junction
H01L 35/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device
H01L 35/34 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
34Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
CPC
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 35/08
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
04Structural details of the junction; Connections of leads
08non-detachable, e.g. cemented, sintered, soldered ; , e.g. thin films
H01L 35/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device ; including details about, e.g., housing, insulation, geometry, module
Applicants
  • NANOCOOLERS, INC. [US]/[US] (AllExceptUS)
  • GHOSHAL, Uttam [US]/[US] (UsOnly)
Inventors
  • GHOSHAL, Uttam
Agents
  • CAVE, Nicole T.
Priority Data
10/756,60313.01.2004US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) THERMOELECTRIC DEVICES
(FR) DISPOSITIFS THERMOELECTRIQUES
front page image
Abstract
(EN) The invention provides a thermoelectric device comprising a first electrode (104), a first thermoelement (102) thermally coupled to the first electrode (104) and a first phonon conduction impeding medium (106) coupled with the first thermoelement (102). The first phonon conduction impeding medium (106) is also thermally insulated from the first electrode (104). The phonon conduction impeding medium (106) may be a liquid metal. The first thermoelement (102) may have a thickness less than a thermalization length associated with the first theroelement (102). In at least one embodiment of the present invention, second electrode is coupled to the first phonon conduction impeding medium (106). The thermoelectric device may include a dielectric material for maintaining spacing between the first electrode and the second electrode. The invention is also contemplated to provide methods for manufacturing and utilizing such structures.
(FR) Dispositif thermoélectrique qui comporte une première électrode (104), un premier thermoélément (102) thermiquement couplé à la première électrode (104) et un premier milieu (106) entravant la conduction de phonons couplé au premier thermoélément (102). Le premier milieu (106) entravant la conduction de phonons est également thermiquement isolé de la première électrode (104). Le milieu (106) entravant la conduction de phonons peut être un métal liquide. Le premier thermoélément (102) peut avoir une épaisseur inférieure à une longueur de thermalisation associée au premier thermoélément (102). Dans au moins un mode de réalisation de la présente invention, une seconde électrode est couplée au premier milieu (106) entravant la conduction de phonons. Ledit dispositif thermoélectrique peut comporter une matière diélectrique destinée à maintenir l'écartement entre la première électrode et la seconde électrode. La présente invention concerne également des procédés de fabrication et d'utilisation de ces structures.
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