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1. WO2005069075 - PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART

Publication Number WO/2005/069075
Publication Date 28.07.2005
International Application No. PCT/JP2004/018832
International Filing Date 16.12.2004
IPC
C08G 69/26 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
69Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
02Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids
26derived from polyamines and polycarboxylic acids
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/037 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
G03F 7/039 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
H01L 21/027 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
CPC
C08K 5/03
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
02Halogenated hydrocarbons
03aromatic ; , e.g. C6H5-CH2-Cl
C08K 5/13
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
04Oxygen-containing compounds
13Phenols; Phenolates
C08K 5/138
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
04Oxygen-containing compounds
13Phenols; Phenolates
138Phenolates
C08L 77/06
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain
06Polyamides derived from polyamines and polycarboxylic acids
C08L 77/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
77Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain
10Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
G03F 7/0045
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
0045with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Applicants
  • 日立化成デュポンマイクロシステムズ株式会社 Hitachi Chemical DuPont Microsystems Ltd. [JP]/[JP] (AllExceptUS)
  • 大江 匡之 OOE, Masayuki [JP]/[JP] (UsOnly)
  • 小松 博 KOMATSU, Hiroshi [JP]/[JP] (UsOnly)
  • 津丸 佳子 TSUMARU, Yoshiko [JP]/[JP] (UsOnly)
  • 川崎 大 KAWASAKI, Dai [JP]/[JP] (UsOnly)
  • 加藤 幸治 KATOU, Kouji [JP]/[JP] (UsOnly)
  • 上野 巧 UENO, Takumi [JP]/[JP] (UsOnly)
Inventors
  • 大江 匡之 OOE, Masayuki
  • 小松 博 KOMATSU, Hiroshi
  • 津丸 佳子 TSUMARU, Yoshiko
  • 川崎 大 KAWASAKI, Dai
  • 加藤 幸治 KATOU, Kouji
  • 上野 巧 UENO, Takumi
Agents
  • 酒井 宏明 SAKAI, Hiroaki
Priority Data
2004-00671514.01.2004JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOSENSITIVE POLYMER COMPOSITION, PROCESS FOR PRODUCING PATTERN, AND ELECTRONIC PART
(FR) COMPOSITION POLYMERE PHOTOSENSIBLE, PROCEDE POUR GENERER UN MOTIF ET COMPOSANT ELECTRONIQUE
(JA) 感光性重合体組成物、パターンの製造法及び電子部品
Abstract
(EN)
A photosensitive polymer composition which comprises (a) a polyamide having repeating units represented by the following general formula (I): [Chemical formula (1)] (wherein U represents a tetravalent organic group; V represents a divalent organic group; and p is an integer indicating the number of the repeating units), (b) a compound which generates an acid by the action of light, and (c) a compound represented by the following general formula (II): [Chemical formula 2] (wherein m and n each independently is 1 or 2; R's each independently represents hydrogen, alkyl, or acyl; and R1 and R2 each independently represents C1-3 fluoroalkyl).
(FR)
L'invention concerne une composition polymère photosensible comportant (a) un polyamide présentant des unités récurrentes de formule générale (I): où U représente un groupe organique tétravalent, V représente un groupe organique divalent, p est un entier représentant le nombre d'unités récurrentes, (b) un composé créant un acide sous l'action de la lumière et (c) un composé de formule générale (II): où m et n sont chacun indépendamment 1 ou 2; tous les R représentent chacun indépendamment hydrogène, alkyle ou acyle et R<sp>1</sp> et R<sp>2</sp> représentent chacun indépendamment C<sb>1-3</sb> fluoroalkyle.
(JA)
 感光性重合体組成物を(a)一般式(I) 【化1】 (式中、Uは4価の有機基を示し、Vは2価の有機基を示す。pは繰り返し単位数を表す整数である。)で表される繰り返し単位を有するポリアミド、(b)光により酸を発生する化合物、および、(c)一般式(II) 【化2】 (式中、m及びnは各々独立に1か2の整数であり、Rは各々独立に水素、アルキル基又はアシル基であり、R1及びR2は各々独立に炭素数1~3のフルオロアルキル基を示す。)で表される化合物を含有して構成する。
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