WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2005068681) CLEANING TANTALUM-CONTAINING DEPOSITS FROM PROCESS CHAMBER COMPONENTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/068681    International Application No.:    PCT/US2004/016518
Publication Date: 28.07.2005 International Filing Date: 25.05.2004
IPC:
C23G 1/08 (2006.01), C23G 1/10 (2006.01), C23G 1/12 (2006.01), C23G 1/19 (2006.01), C23G 1/20 (2006.01), C23G 1/22 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; Patent Department, M/S 2061, P.O. Box 450A, Santa Clara, CA 95052 (US) (For All Designated States Except US)
Inventors: BRUECKNER, Karl; (US).
WANG, Hong; (US)
Agent: JANAH, Ashok, K.; Janah & Associates, P.C., 650 Delancey Street, Suite 106, San Francisco, CA 94107 (US)
Priority Data:
10/742,604 19.12.2003 US
10846894 13.05.2004 US
Title (EN) CLEANING TANTALUM-CONTAINING DEPOSITS FROM PROCESS CHAMBER COMPONENTS
(FR) NETTOYAGE DE DEPOTS CONTENANT DU TANTALE DE COMPOSANTS DE CHAMBRE DE TRAITEMENT
Abstract: front page image
(EN)A method of cleaning tantalum-containing deposits from a surface of a process chamber component includes immersing the surface of the component in a cleaning solution having a ration of HF to HNO3 of from about 1:8 to about 1:30 by weight. In another version, the cleaning solution has a ration of KOH to H2O2 of from about 6:1 to about 10:1 by moles. In yet another version suitable for cleaning copper surfaces, the cleaning solution includes HF and an oxidizing agent in a molar ratio of HF to the oxidizing agent of at least about 6:1. The tantalum-containing deposits can be removed from the surface substantially without eroding the surface.
(FR)L'invention porte sur un procédé de nettoyage de dépôts contenant du tantale d'une surface d'un composant de chambre de traitement. Ce procédé consiste à immerger la surface du composant dans une solution de nettoyage possédant un rapport HF/HNO3 compris entre 1:8 et 1:30 environ en poids. Dans une autre version, le solution de nettoyage possède un rapport KOH/H2O2 compris entre 6:1 et 10:1 environ en moles. Dans une version différente qui convient au nettoyage de surfaces en cuivre, la solution de nettoyage contient HF et un agent d'oxydation dans un rapport molaire HF/agent oxydant de l'ordre de 6:1. Les dépôts contenant du tantale peuvent être ôtés de la surface presque sans abîmer celle-ci.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)