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1. WO2005067062 - SUBSTRATE WITH LIGHT INPUT, SUBSTRATE WITH LIGHT OUTPUT, SUBSTRATE WITH LIGHT INPUT/OUTPUT, AND SEMICONDUCTOR INTEGRATED CIRCUIT WITH OPTICAL ELEMENT

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Publication Number WO/2005/067062
Publication Date 21.07.2005
International Application No. PCT/JP2004/015159
International Filing Date 14.10.2004
IPC
H01L 27/14 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H01L 31/12 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
12structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
CPC
H01L 2224/73253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73253Bump and layer connectors
H01L 2224/92225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
92Specific sequence of method steps
922Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
9222Sequential connecting processes
92222the first connecting process involving a bump connector
92225the second connecting process involving a layer connector
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 31/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
12structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
Applicants
  • 日本電気株式会社 NEC CORPORATION [JP]/[JP] (AllExceptUS)
  • 小田 三紀雄 ODA, Mikio [JP]/[JP] (UsOnly)
  • 高橋 久弥 TAKAHASHI, Hisaya [JP]/[JP] (UsOnly)
  • 中野 嘉一郎 NAKANO, Kaichiro [JP]/[JP] (UsOnly)
  • 古宇田 光 KOUTA, Hikaru [JP]/[JP] (UsOnly)
  • 小林 功郎 KOBAYASHI, Kohroh [JP]/[JP] (UsOnly)
Inventors
  • 小田 三紀雄 ODA, Mikio
  • 高橋 久弥 TAKAHASHI, Hisaya
  • 中野 嘉一郎 NAKANO, Kaichiro
  • 古宇田 光 KOUTA, Hikaru
  • 小林 功郎 KOBAYASHI, Kohroh
Agents
  • 宮崎 昭夫 MIYAZAKI, Teruo
Priority Data
2003-43402826.12.2003JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE WITH LIGHT INPUT, SUBSTRATE WITH LIGHT OUTPUT, SUBSTRATE WITH LIGHT INPUT/OUTPUT, AND SEMICONDUCTOR INTEGRATED CIRCUIT WITH OPTICAL ELEMENT
(FR) SUBSTRAT A ENTREE DE LUMIERE, SUBSTRAT A SORTIE DE LUMIERE, SUBSTRAT A ENTREE/SORTIE DE LUMIERE, ET CIRCUIT INTEGRE A SEMI-CONDUCTEURS EQUIPE D'UN ELEMENT OPTIQUE
(JA) 光入力付基板、光出力付基板、光入出力付基板及び光素子一体型半導体集積回路
front page image
Abstract
(EN) Light-receiving elements (2a) each for converting an optical signal inputted from outside into an electric signal and outputting it to an output port are provided to two or more input ports on a substrate (1) on which a semiconductor integrated circuit can be mounted. The heights of the light-receiving elements (2a) are the same. An electric signal input port of the mounted semiconductor integrated circuit can be connected to the output port of the substrate (1).
(FR) L'invention concerne des éléments (2a) de réception de lumière servant chacun à convertir un signal optique entrant de l'extérieur en signal électrique, et à transmettre celui-ci à un port de sortie, lesdits éléments étant situés sur deux ou plusieurs ports d'entrée d'un substrat (1) sur lequel peut être monté un circuit intégré à semi-conducteurs. Les hauteurs des éléments (2a) de réception de lumière sont identiques. Un port d'entrée de signaux électriques du circuit intégré à semi-conducteurs monté peut être connecté au port de sortie du substrat (1).
(JA) 　半導体集積回路を実装可能な基板１の２以上の入力ポートに、外部から入力 された光信号を電気信号に変換して出力ポートに出力可能な受光素子２ａが実装され、かつ、それら２以上の受光素子２ａは高さが一定に揃えられており、上記基板１の出力ポートには実装されている半導体集積回路の電気信号入力ポートが接続可能である。
Related patent documents
US20070165979
JPWO2005067062
US2007165979This application is not viewable in PATENTSCOPE because the national phase entry has not been published yet or the national entry is issued from a country that does not share data with WIPO or there is a formatting issue or an unavailability of the application.
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