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Machine translation
1. (WO2005064689) OPTICAL DATA COMMUNICATION MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/064689    International Application No.:    PCT/JP2004/019090
Publication Date: 14.07.2005 International Filing Date: 21.12.2004
IPC:
H01L 31/02 (2006.01), H01L 31/12 (2006.01)
Applicants: ROHM CO., LTD. [JP/JP]; 21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto-shi, Kyoto 6158585 (JP) (For All Designated States Except US).
HORIO, Tomoharu [JP/JP]; (JP) (For US Only)
Inventors: HORIO, Tomoharu; (JP)
Agent: YOSHIDA, Minoru; 2-32-1301, Tamatsukuri-motomachi Tennoji-ku, Osaka-shi, Osaka 5430014 (JP)
Priority Data:
2003-429322 25.12.2003 JP
Title (EN) OPTICAL DATA COMMUNICATION MODULE
(FR) MODULE DE TRANSMISSION OPTIQUE DE DONNEES
(JA) 光データ通信モジュール
Abstract: front page image
(EN)Disclosed is an infrared data communication module (1) comprising an infrared light-emitting device (3), an infrared light-receiving device (4) and an IC chip (5). The light-emitting device (3), light-receiving device (4) and IC chip (5) are mounted on a substrate (2) and covered with a sealing resin package (6). The substrate (2) is provided with a recessed portion (22) whose inner surface is covered with a ground-connected metal film (7), and the light-emitting device (3) is arranged in the recessed portion (22).
(FR)L'invention concerne un module de transmission infrarouge (1) de données comprenant un dispositif photoémetteur infrarouge (3), un dispositif photorécepteur infrarouge (4) et une puce CI (5). Le dispositif photoémetteur (3), le dispositif photorécepteur (4) et la puce CI (5) sont montés sur un substrat (2) et recouverts d'un boîtier en résine d'étanchéité (6). Le substrat (2) est doté d'une partie évidée (22) dont la surface intérieure est recouverte d'une couche mince métallique (7) reliée à la masse, et le dispositif photoémetteur (3) est agencé dans la partie évidée (22).
(JA)赤外線データ通信モジュール1は、赤外線発光素子3、赤外線受光素子4、およびICチップ5を備えている。発光素子3、受光素子4、およびICチップ5は基板2に搭載されて封止樹脂パッケージ6により覆われている。基板2には、グランド接続された金属膜7によって内面が覆われた凹部22が形成されており、かつこの凹部22内に、発光素子3が配されている。                                                                       
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)