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Machine translation
1. (WO2005064657) METHOD OF SEALING TWO PLATES WITH THE FORMATION OF AN OHMIC CONTACT THEREBETWEEN
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2005/064657    International Application No.:    PCT/FR2004/050742
Publication Date: 14.07.2005 International Filing Date: 21.12.2004
Chapter 2 Demand Filed:    16.08.2005    
IPC:
H01L 21/18 (2006.01), H01L 21/265 (2006.01), H01L 21/266 (2006.01)
Applicants: COMMISSARIAT A L'ENERGIE ATOMIQUE [FR/FR]; 31-33 rue de la Fédération, F-75752 PARIS 15ème (FR) (For All Designated States Except US).
POCAS, Stéphane [FR/FR]; (FR) (For US Only).
MORICEAU, Hubert [FR/FR]; (FR) (For US Only).
MICHAUD, Jean-François [FR/FR]; (FR) (For US Only)
Inventors: POCAS, Stéphane; (FR).
MORICEAU, Hubert; (FR).
MICHAUD, Jean-François; (FR)
Agent: LEHU, Jean; Brevatome, 3, rue du Docteur Lancereaux, F-75008 PARIS (FR)
Priority Data:
0351190 23.12.2003 FR
Title (EN) METHOD OF SEALING TWO PLATES WITH THE FORMATION OF AN OHMIC CONTACT THEREBETWEEN
(FR) PROCEDE DE SCELLEMENT DE DEUX PLAQUES AVEC FORMATION D'UN CONTACT OHMIQUE ENTRE CELLES-CI
Abstract: front page image
(EN)The invention relates to a method of sealing two plates (2, 12) which are made from semiconductor materials. The inventive method comprises the following steps consisting in: implanting metal species (4) in at least the first plate; assembling the first and second plates; and annealing same.
(FR)L'invention concerne un procédé de scellement de deux plaques (2, 12) de matériaux semi-conducteurs, comportant : une étape d'implantation d'espèces métalliques (4) dans au moins la première plaque ; une étape d'assemblage de la première et de la deuxième plaque ; une étape de recuit.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: French (FR)
Filing Language: French (FR)