Processing

Please wait...

Settings

Settings

Goto Application

1. WO2005063909 - ADHESIVE FILM USED TO IMPLANT ELECTRIC MODULES IN A CARD BODY

Publication Number WO/2005/063909
Publication Date 14.07.2005
International Application No. PCT/EP2004/053632
International Filing Date 21.12.2004
IPC
C09J 7/00 2006.01
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
G06K 19/077 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
CPC
C09J 2203/326
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2203Applications of adhesives in processes or use of adhesives in the form of films or foils
326for bonding electronic components such as wafers, chips or semiconductors
C09J 2301/304
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
30characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
304the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
C09J 2421/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2421Presence of unspecified rubber
C09J 7/10
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
10without carriers
G06K 19/07745
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07745Mounting details of integrated circuit chips
G06K 19/07747
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07745Mounting details of integrated circuit chips
07747at least one of the integrated circuit chips being mounted as a module
Applicants
  • TESA AG [DE]/[DE] (AllExceptUS)
  • HUSEMANN, Marc [DE]/[DE] (UsOnly)
  • BARGMANN, Renke [DE]/[DE] (UsOnly)
Inventors
  • HUSEMANN, Marc
  • BARGMANN, Renke
Common Representative
  • TESA AG
Priority Data
103 61 541.523.12.2003DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) KLEBFOLIE ZUR IMPLANTIERUNG VON ELEKTRISCHEN MODULEN IN EINEN KARTENKÖRPER
(EN) ADHESIVE FILM USED TO IMPLANT ELECTRIC MODULES IN A CARD BODY
(FR) FILM ADHESIF DESTINE A L'IMPLANTATION DE MODULES ELECTRIQUES DANS UN CORPS CARTE
Abstract
(DE)
Klebstofffolie, bestehend aus einem Blend aus einem synthetischen Kautschuk S1 und einem Thermoplasten 2, wobei a) der Blend mikrophasensepariert ist; b) der Blend mindestens 2 Erweichungstemperaturen besitzt, wobei mindestens eine Erweichungstemperatur grösser 65°C und kleiner 125°C ist; c) einen nach Testmethode A gemessenen G' bei 23°C von größer 107 Pas besitzt; d) einen nach Testmethode A gemessenen G' bei 23°C von grösser 106 Pas besitzt; e) und einen nach Testmethode A gemessenen crossover von kleiner 125°C aufweist zur Verklebung von elektrischen Modulen in Chipkarten.
(EN)
The invention relates to an adhesive film, comprising a blend made of synthetic rubber S1 and thermoplastics 2 which are used to stick electric modules to chip cards. According to the invention, a) the blend is separated into microphases; b) the blend has at least two softening temperatures, wherein at least one softening temperature is higher than 65 °C and lower than 125 °C; c) a G' measured according to test method A at 23 °C is 107 Pas; d) a G' measured according to test method A at 23 °C is 106 Pas; e) and a crossover measured according to test method A is less than 125 °C.
(FR)
L'invention concerne un film adhésif composé d'un mélange constitué d'un caoutchouc synthétique S1 et d'un thermoplastique (2) et destiné à coller des modules électriques dans des cartes à puces. Selon l'invention, a) le mélange est séparé en microphases; b) le mélange a au moins 2 températures de ramollissement, au moins une température de ramollissement étant supérieure à 65 °C et inférieure à 125 °C; c) il a un G' mesuré d'après la méthode de test A à 23 °C de 107 Pas minimum ; d) un G'' mesuré d'après la méthode de test A à 23 °C de 106 Pas minimum ; e) et a un croisement mesuré d'après la méthode de test A de 125 °C maximum.
Also published as
DE112004002184
DE1120040021847
Latest bibliographic data on file with the International Bureau